MCP4641-103E/ST Microchip Technology, MCP4641-103E/ST Datasheet - Page 66

• Manufacturer Part Number: MCP4641-103E/ST
• Description: IC DGTL POT 10K 256TAPS 14-TSSOP
• Manufacturer: Microchip Technology

Specifications of MCP4641-103E/ST

• Taps: 129
• Resistance (ohms): 10K
• Number Of Circuits: 2
• Temperature Coefficient: 150 ppm/°C Typical
• Memory Type: Non-Volatile
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 14-TSSOP
• Resistance In Ohms: 10K
• End To End Resistance: 100kohm
• Track Taper: Linear
• Resistance Tolerance: ± 20%
• No. Of Steps: 128
• Supply Voltage Range: 2.7V To 5.5V
• Control Interface: I2C, Serial
• No. Of Pots: Dual
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MCP453X/455X/463X/465X
8.5
In the design of a system with the MCP4XXX devices,
the following considerations should be taken into
account:
•
•
8.5.1
The typical application will require a bypass capacitor
in order to filter high-frequency noise, which can be
induced onto the power supply's traces. The bypass
capacitor helps to minimize the effect of these noise
sources on signal integrity.
appropriate bypass strategy.
In this example, the recommended bypass capacitor
value is 0.1 µF. This capacitor should be placed as
close (within 4 mm) to the device power pin (V
possible.
The power source supplying these devices should be
as clean as possible. If the application circuit has
separate digital and analog power supplies, V
V
FIGURE 8-7:
Connections.
DS22096A-page 66
SS
Power Supply Considerations
Layout Considerations
should reside on the analog plane.
W
A
B
Design Considerations
POWER SUPPLY
CONSIDERATIONS
0.1 µF
V
V
Typical Microcontroller
DD
SS
Figure 8-7
0.1 µF
SDA
SCL
illustrates an
V
V
DD
SS
DD
DD
) as
and
8.5.2
Inductively-coupled AC transients and digital switching
noise can degrade the input and output signal integrity,
potentially masking the MCP4XXX’s performance.
Careful board layout minimizes these effects and
increases the Signal-to-Noise Ratio (SNR). Multi-layer
boards utilizing a low-inductance ground plane,
isolated inputs, isolated outputs and proper decoupling
are critical to achieving the performance that the silicon
is capable of providing. Particularly harsh environ-
ments may require shielding of critical signals.
If low noise is desired, breadboards and wire-wrapped
boards are not recommended.
8.5.3
Characterization curves of the resistor temperature
coefficient (Tempco) are shown in
Figure
These curves show that the resistor network is
designed to correct for the change in resistance as
temperature increases. This technique reduces the
end to end change is R
8.5.4
High Voltage support (V
is for compatibility with the non-volatile devices..
2-25,
LAYOUT CONSIDERATIONS
RESISTOR TEMPCO
HIGH VOLTAGE TOLERANT PINS
Figure
2-38, and
AB
IHH
© 2008 Microchip Technology Inc.
resistance.
) on the Serial Interface pins
Figure
2-51.
Figure
2-12,