MCP4251-103E/ML Microchip Technology, MCP4251-103E/ML Datasheet - Page 3
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MCP4251-103E/ML
Manufacturer Part Number
MCP4251-103E/ML
Description
IC POT DGTL DUAL 10K SPI 16QFN
Manufacturer
Microchip Technology
Specifications of MCP4251-103E/ML
Package / Case
16-QFN
Taps
257
Resistance (ohms)
10K
Number Of Circuits
2
Temperature Coefficient
150 ppm/°C Typical
Memory Type
Volatile
Interface
SPI Serial
Voltage - Supply
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Resistance In Ohms
10K
Number Of Pots
Dual
Taps Per Pot
256
Resistance
10 KOhms
Wiper Memory
Volatile
Digital Interface
Serial (SPI)
Operating Supply Voltage
2.5 V, 3.3 V, 5 V
Supply Current
1 mA
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.8 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCP4251-103E/ML
Manufacturer:
MICROCHIP
Quantity:
1 900
Part Number:
MCP4251-103E/ML
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
1.0
Absolute Maximum Ratings †
Voltage on V
Voltage on CS, SCK, SDI, SDI/SDO, and
SHDN with respect to V
Voltage on all other pins (PxA, PxW, PxB, and
SDO) with respect to V
Input clamp current, I
(V
Output clamp current, I
(V
Maximum output current sunk by any Output pin
Maximum output current sourced by any Output pin
Maximum current out of V
Maximum current into V
Maximum current into P
Storage temperature ....................................-65°C to +150°C
Ambient temperature with power applied
Total power dissipation (Note 1) ................................400 mW
Soldering temperature of leads (10 seconds) ............. +300°C
ESD protection on all pins .................................. ≥ 4 kV (HBM),
Maximum Junction Temperature (T
© 2008 Microchip Technology Inc.
......................................................................................25 mA
......................................................................................25 mA
.......................................................................... ≥ 300V (MM)
.....................................................................-40°C to +125°C
I
O
Note 1: Power dissipation is calculated as follows:
< 0, V
< 0 or V
I
ELECTRICAL
CHARACTERISTICS
> V
O
DD
DD
> V
with respect to V
, V
DD
I
) ..................................................±20 mA
> V
Pdis = V
IK
SS ............................
OK
SS ......................................
PP ON
DD
X
A, P
SS
pin ....................................100 mA
pin .................................100 mA
X
DD
HV pins) ......................±20 mA
W & P
SS
x {I
J
............... -0.6V to +7.0V
) ......................... +150°C
X
DD
B pins ............±2.5 mA
- ∑ I
-0.3V to V
OH
-0.6V to 12.5V
} + ∑ {(V
DD
+ 0.3V
MCP413X/415X/423X/425X
DD
-V
OH
) x I
OH
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
} + ∑(V
O
l x I
OL
)
DS22060B-page 3