AD5204BRU10 Analog Devices Inc, AD5204BRU10 Datasheet - Page 6
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AD5204BRU10
Manufacturer Part Number
AD5204BRU10
Description
IC DGTL POT QUAD 256POS 24-TSSOP
Manufacturer
Analog Devices Inc
Datasheet
1.AD5204BRUZ50.pdf
(20 pages)
Specifications of AD5204BRU10
Rohs Status
RoHS non-compliant
Taps
256
Resistance (ohms)
10K
Number Of Circuits
4
Temperature Coefficient
700 ppm/°C Typical
Memory Type
Volatile
Interface
SPI, 3-Wire Serial
Voltage - Supply
2.7 V ~ 5.5 V, ±2.3 V ~ 2.7 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
24-TSSOP
Resistance In Ohms
10K
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AD5204BRU10-REEL7
Manufacturer:
SAMSUNG
Quantity:
1 400
AD5204/AD5206
ABSOLUTE MAXIMUM RATINGS
T
Table 2.
Parameter
V
V
V
V
I
Digital Input and Output Voltage
Operating Temperature Range
Maximum Junction Temperature
Storage Temperature
Reflow Soldering
Package Power Dissipation
Thermal Resistance, θ
1
2
A
Maximum terminal current is bounded by the maximum current handling of
Thermal resistance (JEDEC 4-layer (2S2P) board). Paddle soldered to board.
the switches, maximum power dissipation of the package, and maximum
applied voltage across any two of the A, B, and W terminals at a given
resistance.
DD
SS
DD
A
A
, I
, V
Pulsed
Continuous
to GND
(T
Peak Temperature
Time at Peak Temperature
PDIP (N-24-1)
SOIC (RW-24)
TSSOP (RU-24)
LFCSP (CP-32-3)
= 25°C, unless otherwise noted.
B
to GND
to GND
to V
, I
J
B
10 kΩ End-to-End Resistance
50 kΩ and 100 kΩ End-to-End
, V
W
max)
W
Resistance
SS
1
to GND
JA
2
Rating
−0.3 V to +7 V
0 V to −7 V
7 V
V
±20 mA
±11 mA
±2.5 mA
−0.3 V to (V
(whichever is less)
−40°C to +85°C
150°C
−65°C to +150°C
260°C
20 sec to 40 sec
(T
63°C/W
52°C/W
50°C/W
32.5°C/W
SS
J
, V
max − T
DD
DD
A
)/θ
+ 0.3 V) or 7 V
JA
Rev. C | Page 6 of 20
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION