MCV1206M560AGT MULTICOMP, MCV1206M560AGT Datasheet - Page 4

• Manufacturer Part Number: MCV1206M560AGT
• Description: VARISTOR, 110V, 1206
• Manufacturer: MULTICOMP

Specifications of MCV1206M560AGT

• Suppressor Type: Varistor
• Peak Surge Current @ 8/20µs: 100A
• Varistor Case: 1206
• Clamping Voltage Vc Max: 110V
• Peak Energy (10/1000us): 1J
• Voltage Rating Vdc: 56V
• Voltage Rating Vac: 40V
• Rohs Compliant: Yes
• Operating Temperature Range: -55°C To +125°C

Specifications
Multilayer Chip Varistors
Electrical Reliability
High temperature storage
Low temperature storage
Humidity storage
Temperature cycles
Mechanical Reliability
Solderability
Resistance to soldering
heat
Adhesive Strength of
Termination
Vibration
Bending Test
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Test Item
Measurement to be made after keeping at room temperature for 24 ±2 hours
+125 ±3°C for 1000 hours
Measurement to be made after keeping at room temperature for 24 ±2 hours
-40 ±3°C for 1000 hours
Measurement to be made after keeping at room temperature for 24 ±2 hours
40 ±2°C, 90 to 95%RH for 500 hours
Measurement to be made after keeping at room temperature for 24 ±2 hours
Solder temperature : 230 ±5°C
Immersion time : 2 ±0.5 seconds
Immersion and emersion rates : 25mm/s
Pre-heating: 120 to 150°C, 60 seconds
Solder temperature: 260 ±5°C
Immersion time: 10 ±1 seconds
Measurement to be made after keeping at room temperature for 24 ±2 hours
Solder chip on PCB and applied
0805/1206 Series: 10N (1Kgf) for 10 seconds
0402/0603 Series: 5N (0.5Kgf) for 10 seconds
Solder Chip on PCB.
Frequency: 10Hz to 55Hz to 10Hz (1min)
Oscillation amplitude: 1.5mm
Times: 2 hours in each of three perpendicular direction
The middle part of substrate shall be pressurized by means of the
pressurizing rod at a rate of 1mm per second until the deflection becomes
1mm and then the pressure shall be maintained for 5 seconds
Times: 5 cycles
Step
1
2
3
4
Test Condition / Test Method
Room temperature
Room temperature
Temperature (°C)
Page <4>
+125 ±3°C
-55 ±3
Chip varistor
Time (Minimum)
30 ±3
2 to 3
30 ±2
2 to 3
Minimum 90%
electrode shall be
covered with solder
Disappearance of
electrode due to
immersion into
solder shall not
exceed 25% of
edges of each
electrode
No visible damage
No visible damage
No visible damage
V at 1mA <10%
V at 1mA <10%
V at 1mA <10%
V at 1mA <10%
V at 1mA <10%
V at 1mA <10%
Specification
04/05/11 V1.1