747459-1 TE Connectivity, 747459-1 Datasheet - Page 2
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747459-1
Manufacturer Part Number
747459-1
Description
D SUB CONNECTOR, STANDARD, 9POS, RCPT
Manufacturer
TE Connectivity
Series
AMPLIMITE HD-20r
Specifications of 747459-1
Connector Type
D Sub
No. Of Contacts
9
D Sub Shell Size
DE
Connector Body Material
Plastic
Gender
Receptacle
Contact Termination
Through Hole
Rohs Compliant
No
Pcb Mounting Orientation
Right Angle
Product Series
HD 20
Mating Connector Lock
Without
Pcb Mount Retention
With
Shell Type
All Plastic
Shell Size
1
Footprint (mm [in])
14.99 [.590]
Grounding Indents
Without
Grounding Straps
Without
Pcb Mount Style
Through Hole
Color Code
None
Sealed
No
Profile
Standard
Post Size (mm [in])
0.66 [.026]
Mounting Hole Diameter (mm [in])
3.18 [.125]
Panel Mount Retention
Without
Grounding Clips
Without
Termination Post Length (mm [in])
3.18 [0.125]
Solder Tail Contact Plating
Tin-Lead over Nickel
Number Of Positions
9
Pcb Mount Retention Type
Mounting Holes
Contact Plating, Mating Area, Material
Gold Flash
Contact Shape
Round
Contact Base Material
Phosphor Bronze
Connector Style
Receptacle
Ul Flammability Rating
UL 94V-0
Housing Material
Thermoplastic - GF
Rohs/elv Compliance
ELV compliant, 5 of 6 Compliant
Lead Free Solder Processes
Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
Pcb Thickness, Recommended (in [mm])
0.093 [2.36]
Application
Standard
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
747459-1
Manufacturer:
TE Connectivity AMP Connectors
Quantity:
457
3.4.
3.5.
Rev C
Exam ination of product.
Term ination resistance, dry circuit.
Insulation resistance.
Dielectric withstanding voltage.
Tem perature rise vs current.
Solderability.
Vibration, random .
Physical shock.
Perform ance and Test Description
Product is designed to m eet the electrical, m echanical and environm ental perform ance requirem ents
specified in Figure 1. All tests are perform ed at am bient tem perature unless otherwise specified.
Test Requirem ents and Procedures Sum m ary
Test Description
15 m illiohm s m axim um initial.
Meets requirem ents of product
drawing and applicable Application
Specification.
20 m illiohm s m axim um final.
5000 m egohm s m inim um initial.
1000 m egohm s m inim um final
within 5 hours after testing.
1 kvac dielectric withstanding
voltage. 1 m inute hold. 1
m illiam pere m axim um leakage
current.
30 C m axim um tem perature rise at
specified current. 70 C m axim um
am bient.
Solderable area shall have a
m inim um of 95% solder coverage.
No discontinuities greater than 1
m icrosecond.
See Note (a).
No discontinuities greater than 1
m icrosecond.
See Note.
Figure 1 (continued)
MECHANICAL
ELECTRICAL
Requirem ent
Visual, dim ensional and functional
per applicable Quality Inspection
plan.
TE Spec 109-6-1.
Subject m ated contacts assem bled
in housings to 50 m v open circuit at
100 m a m axim um .
See Figure 3.
TE Spec 109-28-4.
Test between adjacent contacts of
unm ated assem blies.
TE Spec 109-29-1.
Test between adjacent contacts of
unm ated assem blies.
TE Spec 109-45-1.
Measure tem perature rise vs
current.
See Figure 4.
TE Spec 109-11-1.
Subject tin-lead plated contact
posts to solderability.
TE Spec 109-21-5, Level F,
20 m inute duration.
Subject m ated connectors to 20 G's
rm s with 100 m a current applied.
See Figure 3.
TE Spec 109-26-1.
Subject m ated connectors to 50 G's
half-sine shock pulses of 11
m illiseconds duration. 3 shocks in
each direction along 3 m utually
perpendicular planes, 18 total
shocks.
See Figure 3.
Procedure
108-40025
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