2013978-2 TE Connectivity, 2013978-2 Datasheet - Page 5

HDMI RECEPTACLE, 19POS, PCB

2013978-2

Manufacturer Part Number
2013978-2
Description
HDMI RECEPTACLE, 19POS, PCB
Manufacturer
TE Connectivity
Series
Type Cr
Datasheets

Specifications of 2013978-2

Connector Type
HDMI
Gender
Receptacle
No. Of Contacts
19
Contact Termination
Surface Mount Horizontal
Connector Mounting
PCB
Contact Plating
Gold
Contact Material
Copper Alloy
Current Rating
500mA
Rohs Compliant
Yes
Size
Mini
Number Of Ports
1
Orientation
Right Angle
Stacked
No
Pcb Thickness (minimum) (mm [in])
1.60 [0.063]
Mount Location
Top
Termination Method
Solder
Panel Ground
Without
Pcb Mount Retention Type
Straight Leg
Shell Plating
Tin over Nickel
Assembly Process Feature
Pick and Place Cover
Locating Post(s)
With
Number Of Positions
19
Contact Termination Type
Surface Mount
Contact Plating, Mating Area, Material
Gold Flash over Palladium Nickel
Contact Plating, Mating Area, Thickness (µm [?in])
0.1 [3.937]
Connector Style
Receptacle
Housing Color
Black
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Reflow solder capable to 245°C
Rohs/elv Compliance History
Always was RoHS compliant
Applies To
Printed Circuit Board
Packaging Method
Emboss on Reel
Para.
項目
3.5.5
3.5.6
Rev.D
温度上昇
Temperature Rising
電気放電
Electrical Discharge
Test Items
試験項目
定格電流を通電して、温度上昇
は30℃以下
30℃ maximum under loaded
Rating current.
コンタクトに放電の形跡の
無いこと。
No evidence of Discharge to
contacts at 8KV.
Requirements
Product Specification
Table. 1 (CONT.)
表. 1 (続く)
製品規格
各極が直列回路になるように接続し、熱電対
をコンタクトはんだ付部に取り付け定格電流
を通電して試験する。
温度は平衡状態に達したものを熱電対計法
によって測定する。
測定値より室温を引いたものを温度上昇値と
する。
Contacts series-wired,apply test current of
loaded rating current to the circuit,and
measure the temperature rising by probing
on soldered areas of contacts,after the
temperature becomes stabilized Deduct
ambient temperature from the measured
value.
IEC-801-2
未嵌合の両コネクタに8mmの球プローブを
使用し1kVから8kVまで1kV毎に試験する。
図2参照
IEC-801-2
Test unmated each connector from 1kV to
8kV in 1kV steps using 8mm ball prove.
Refer to Fig 2.
Procedures
108-78487
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