1766735-2 TE Connectivity, 1766735-2 Datasheet

CONN,SKT W/LATCH,SMT,MC-P7S12

1766735-2

Manufacturer Part Number
1766735-2
Description
CONN,SKT W/LATCH,SMT,MC-P7S12
Manufacturer
TE Connectivity
Datasheet

Specifications of 1766735-2

Pcb Mount Retention
With
Termination Method To Pc Board
Surface Mount
Pcb Mounting Orientation
Vertical
Pcb Mount Alignment
With
Make First / Break Last
No
Csa File Number
1935071
Number Of Power Positions
14
Mating Retention Type
Latching
Contact - Rated Current (a)
25
Hot Pluggable
No
Operating Voltage Reference
AC
Operating Voltage (vac)
250
Tail Orientation
In-line
Profile Height (y-axis) (mm [in])
20.00 [0.787]
Number Of Positions
38
Number Of Signal Positions
24
Pcb Mount Retention Type
Boardlock(s)
Centerline (mm [in])
1.27 [0.050]
Centerline, Power Contacts (mm [in])
9.70 [0.381]
Mating Retention
With
Number Of Rows
2
Length (x-axis) (mm [in])
114.47 [4.510]
Width (z-axis) (mm [in])
9.03 [0.3555]
Card Slot Depth (mm [in])
6.00 [0.236]
Tail Plating Material
Matte Tin
Tail Plating, Thickness (µm [?in])
3.05 [120]
Contact Design
Multiple Contact Band/CROWN BAND
Contact Type
Socket
Contact Base Material
Copper Alloy
Contact Plating, Mating Area, Material
Gold
Contact Plating, Mating Area, Thickness (µm [?in])
0.762 [30]
Connector Style
Receptacle
Mating Alignment
With
Mating Alignment Type
Blindmate, Blindmate/Keyed, Keyed
Housing Material
Thermoplastic
Housing Color
Black
Ul Flammability Rating
UL 94V-0
Connector Contact Configuration (no. Of Pos./type)
2/AC Power, 24/Signal, 12/AC Power
Custom Configurable
Yes
Agency/standard
UL, CSA
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Reflow solder capable to 245°C, Reflow solder capable to 260°C
Rohs/elv Compliance History
Always was RoHS compliant
Agency/standard Number
UL 1977
Ul Voltage Rating (vac)
250
Industry Standard
VRM 12.X
Operating Temperature (°c [°f])
-55 – +105 [-67 – +221]
Board-to-board Configuration
Right Angle
Accepts Card Width (mm [in])
93.37 [3.68]
Accepts Card Thickness (mm [in])
1.57 [0.062]
Applies To
Printed Circuit Board
Application Use
Board-to-Board, Card Edge, Board-to-Board / Card Edge
Contact Transmits (typical Application)
Power, Signal (Data), Signal (Data)/ Power
Pick And Place Cover
Without
Packaging Method
Tray

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1766735-2 Summary of contents

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