MAX5874EGK+D Maxim Integrated Products, MAX5874EGK+D Datasheet - Page 2

• Manufacturer Part Number: MAX5874EGK+D
• Description: IC DAC 14BIT 200MSPS DUAL 68-QFN
• Manufacturer: Maxim Integrated Products

Specifications of MAX5874EGK+D

• Settling Time: 14ns
• Number Of Bits: 14
• Data Interface: Parallel
• Number Of Converters: 2
• Voltage Supply Source: Analog and Digital
• Power Dissipation (max): 300mW
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 68-QFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
AV
AV
DACREF, REFIO, FSADJ to GND,
OUTIP, OUTIN, OUTQP,
CLKP, CLKN to GND, DACREF..............-0.3V to (AV
A13/B13–A0/B0, XOR, SELIQ to GND,
14-Bit, 200Msps, High-Dynamic-Performance,
Dual DAC with CMOS Inputs
ELECTRICAL CHARACTERISTICS
(AV
terminated, transformer-coupled output, I
(Note 2)
Note 1: Thermal resistors based on a multilayer board with 4 x 4 via array in exposed paddle area.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
STATIC PERFORMANCE
Resolution
Integral Nonlinearity
Differential Nonlinearity
Offset Error
Offset-Drift Tempco
Full-Scale Gain Error
Gain-Drift Tempco
Full-Scale Output Current
Output Compliance
Output Resistance
Output Capacitance
DYNAMIC PERFORMANCE
Clock Frequency
Output Update Rate
Noise Spectral Density
OUTQN to GND, DACREF ....................-1V to (AV
DACREF.......................................... -0.3V to (AV
DACREF...............................................-0.3V to (DV
DD1.8
DD3.3
DD3.3
_______________________________________________________________________________________
, DV
, DV
= DV
PARAMETER
DD1.8
DD3.3
DD3.3
, AV
to GND, DACREF ................. -0.3V to +2.16V
= AV
CLK
CLK
to GND, DACREF ....... -0.3V to +3.9V
= 3.3V, AV
SYMBOL
I
GE
OUTFS
R
C
f
DNL
f
INL
DAC
CLK
DD1.8
OUTFS
OS
OUT
OUT
FS
= DV
= 20mA, T
Measured differentially
Measured differentially
External reference
Internal reference
External reference
(Note 3)
Single-ended
f
f
f
f
DAC
DAC
DAC
DAC
DD3.3
DD3.3
DD3.3
DD1.8
CLK
= f
= f
= 150MHz
= 200MHz
+ 0.3V)
+ 0.3V)
+ 0.3V)
+ 0.3V)
CLK
CLK
= 1.8V, GND = 0, external reference V
A
= T
, dual-port mode
/ 2, single-port mode
MIN
CONDITIONS
to T
f
f
OUT
OUT
TORB, DORI, PD to GND, DACREF ....-0.3V to (DV
Continuous Power Dissipation (T
Thermal Resistance θ
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
MAX
68-Pin QFN-EP
(derate 41.7mW/°C above +70°C) (Note 1) ............3333.3mW
= 16MHz, -12dBFS
= 80MHz, -12dBFS
, unless otherwise noted. Typical values are at T
JA
(Note 1)...................................+24°C/W
REFIO
-0.025
MIN
-0.5
2
1
1
1
= 1.25V, output load 50Ω double-
A
= +70°C)
±0.001
±100
±0.7
TYP
-160
-158
±10
±50
14
±1
±1
1
5
+0.025
MAX
+1.1
200
100
200
20
DD3.3
A
= +25°C.)
dBFS/Hz
ppm/°C
ppm/°C
UNITS
+ 0.3V)
Msps
%FS
%FS
MHz
LSB
LSB
Bits
MΩ
mA
pF
V