T0603F104ZCT MULTICOMP, T0603F104ZCT Datasheet - Page 11

CAPACITOR CERAMIC, 0.1UF, 25V, Y5V, 0603

T0603F104ZCT

Manufacturer Part Number
T0603F104ZCT
Description
CAPACITOR CERAMIC, 0.1UF, 25V, Y5V, 0603
Manufacturer
MULTICOMP
Datasheet

Specifications of T0603F104ZCT

Dielectric Characteristic
Y5V
Capacitance
0.1µF
Capacitance Tolerance
+80, -20%
Voltage Rating
25VDC
Capacitor Case Style
0603
No. Of Pins
2
Capacitor Mounting
SMD
Rohs Compliant
Yes
Precautions for Assembly
Adhesives for Mounting
(1) Selection of adhesives
a. The viscosity of an adhesive for mountings shall be such that the adhesive dose not flow off on the land during its curing.
b. If the adhesive is too low in its viscosity, mounted components may be out of alignment after or during soldering.
c. The adhesives shall not be corrosive or chemically active to the mounted components and the PC boards.
d. The amount of adhesive shall be such that the adhesive does not flow off or be out of alignment.
e. Adhesives for mountings can be cured by ultraviolet or infrared radiation. In order to prevent the terminal electrodes of the
Capacitors the curing shall be done at conditions of 180°C maximum, for 2 minutes maximum.
Chip Mounting consideration
In mounting the Capacitors / components on a printed circuit board, any bending and expanding force against them shall be kept
minimum to prevent them from being damaged or cracked.
Following precautions and recommendation shall be observed carefully in the process:
(1) Maximum stroke of the vacuum nozzle shall be adjusted so that the pushing force to the printed circuit board shall be limited to a
static of 1 to 3 N (100 to 300 gf) (See Figure4).
(2) Maximum stroke of the nozzle shall be adjusted so that the maximum bending of printed circuit board dose not exceeded 0.5mm
(See Figure 4)
Figure 4
(3) The printed circuit board shall be supported by means of adequate supporting pins as shown in Fig.5-(b)
Figure 5
Nickel Barrier
Multilayer Ceramic Capacitors
Page 11
27/04/06 V1.0

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