LTC2612CMS8#PBF Linear Technology, LTC2612CMS8#PBF Datasheet - Page 12
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LTC2612CMS8#PBF
Manufacturer Part Number
LTC2612CMS8#PBF
Description
IC DAC 14BIT DUAL R-R VOUT 8MSOP
Manufacturer
Linear Technology
Datasheet
1.LTC2622IMS8PBF.pdf
(16 pages)
Specifications of LTC2612CMS8#PBF
Settling Time
9µs
Number Of Bits
14
Data Interface
Serial
Number Of Converters
2
Voltage Supply Source
Single Supply
Power Dissipation (max)
6.5mW
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
Lead Free Status / RoHS Status
Lead free / RoHS compliant by exemption
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
LTC2602/LTC2612/LTC2622
OPERATIO
Board Layout
The excellent load regulation and DC crosstalk perfor-
mance of these devices is achieved in part by keeping
“signal” and “power” grounds separated internally and by
reducing shared internal resistance.
The GND pin functions both as the node to which the
reference and output voltages are referred and as a return
path for power currents in the device. Because of this,
careful thought should be given to the grounding scheme
and board layout in order to ensure rated performance.
The PC board should have separate areas for the analog
and digital sections of the circuit. This keeps digital signals
away from sensitive analog signals and facilitates the use
of separate digital and analog ground planes which have
minimal capacitive and resistive interaction with each
other.
Digital and analog ground planes should be joined at only
one point, establishing a system star ground as close to
the device’s ground pin as possible. Ideally, the analog
ground plane should be located on the component side of
the board, and should be allowed to run under the part to
shield it from noise. Analog ground should be a continu-
ous and uninterrupted plane, except for necessary lead
pads and vias, with signal traces on another layer.
12
U
The GND pin of the part should be connected to analog
ground. Resistance from the GND pin to system star
ground should be as low as possible. Resistance here will
add directly to the effective DC output impedance of the
device (typically 0.050Ω), and will degrade DC crosstalk.
Note that the LTC2602/LTC2612/LTC2622 are no more
susceptible to these effects than other parts of their type;
on the contrary, they allow layout-based performance
improvements to shine rather than limiting attainable
performance with excessive internal resistance.
Rail-to-Rail Output Considerations
In any rail-to-rail voltage output device, the output is
limited to voltages within the supply range.
Since the analog outputs of the device cannot go below
ground, they may limit for the lowest codes as shown in
Figure 3b. Similarly, limiting can occur near full scale
when the REF pin is tied to V
full-scale error (FSE) is positive, the output for the highest
codes limits at V
limiting can occur if V
Offset and linearity are defined and tested over the region
of the DAC transfer function where no output limiting can
occur.
CC
as shown in Figure 3c. No full-scale
REF
is less than V
CC
. If V
REF
= V
CC
CC
– FSE.
and the DAC
2602fa