LTC2600CGN#TR Linear Technology, LTC2600CGN#TR Datasheet - Page 18
![IC DAC R-R 16-BIT OCTAL 16-SSOP](/photos/6/59/65965/161-16-ssop_sml.jpg)
LTC2600CGN#TR
Manufacturer Part Number
LTC2600CGN#TR
Description
IC DAC R-R 16-BIT OCTAL 16-SSOP
Manufacturer
Linear Technology
Datasheet
1.LTC2620CUFDPBF.pdf
(20 pages)
Specifications of LTC2600CGN#TR
Settling Time
10µs
Number Of Bits
16
Data Interface
Serial
Number Of Converters
8
Voltage Supply Source
Single Supply
Power Dissipation (max)
20mW
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
16-SSOP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
LTC2600/LTC2610/LTC2620
PACKAGE DESCRIPTION
18
4.50 0.05
3.10 0.05
1.50 REF
5.00 0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
2.65 0.05
0.50 BSC
PIN 1
TOP MARK
(NOTE 6)
0.25 0.05
3.65 0.05
4.10 0.05
5.50 0.05
4.00 0.10
(2 SIDES)
2.50 REF
(Reference LTC DWG # 05-08-1711 Rev B)
20-Lead Plastic QFN (4mm × 5mm)
UFD Package
0.70 0.05
0.75 0.05
PACKAGE OUTLINE
0.200 REF
0.00 – 0.05
2.50 REF
R = 0.05 TYP
R = 0.115
TYP
BOTTOM VIEW—EXPOSED PAD
3.65 0.10
2.65 0.10
1.50 REF
19
20
0.50 BSC
0.25 0.05
PIN 1 NOTCH
R = 0.20 OR
C = 0.35
(UFD20) QFN 0506 REV B
1
2
0.40 0.10
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