ZICM0868P0-1CS CALIFORNIA EASTERN LABS, ZICM0868P0-1CS Datasheet - Page 9

• Manufacturer Part Number: ZICM0868P0-1CS
• Manufacturer: CALIFORNIA EASTERN LABS

Specifications of ZICM0868P0-1CS

• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Processing Unit: Microcontroller
• Operating Supply Voltage (min): 1.8V
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Pin Count: 56
• Mounting: Surface Mount
• Rad Hardened: No
• Lead Free Status / Rohs Status: Compliant

MeshConnect I/O PIN ASSIGNMENTS
SOFTWARE/FIRMWARE
The Sub-G modules support the following software:
The MeshConnect Sub-G Development Kits provide an excellent platform to evaluate the hardware as well as develop ap-
plication code for the various software solutions supported. It also provides a set of demo applications to conduct several
tests. Below is the list of the demo software features:
Number
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
•
•
•
•
Synapse SNAP Embedded Firmware
Wireless M-Bus (868 MHz Only)
CEL Application Programming Interface (API)
Silicon Labs EZMac
Name
NIRQ
GND
GND
GND
GND
GND
P2.2
P2.1
P2.0
P1.7
P1.6
P1.5
GND
GND
GND
GND
GND
GND
GND
SDN
NC
NC
GPIO connected to LED2 on CEL Eval board
GPIO connected to Switch 1 on CEL Eval Board
GPIO connected to LED1 on CEL Eval board
GPIO connected to Switch 0 on CEL Eval Board
GPIO connected to LED0 on CEL Eval board
Memory IC MOSI
External Interrupt Request. Must be connected to P0.1 for SNAP firmware to be operational.
Radio Shutdown (Active High)
(Continued)
Notes
MeshConnect™ Sub-G Module Series
Page 9