EVB-USB2240-IND Standard Microsystems (SMSC), EVB-USB2240-IND Datasheet - Page 5

• Manufacturer Part Number: EVB-USB2240-IND
• Manufacturer: Standard Microsystems (SMSC)

Specifications of EVB-USB2240-IND

• Lead Free Status / Rohs Status: Compliant

EVB-USB2240-IND User Manual Revision B
SMSC EVB-USB2240-IND
2.1.8
Layout Considerations
The EVB-USB2240-IND is designed on four PCB layers: two signal layers and two supply layers. The
PCB layer stack is shown in
layers are ground and power. Note that the media I/F signals flow easily to their destination connectors
simplifying routing of critical signals.
The component side top layer is shown in
locations. Solder side and bottom layer is shown in
Component Side
Solder mask
Solder mask
Solder Side
Pre-preg
Pre-preg
Layer 1
Layer 2
Layer 3
Layer 4
Core
Figure 2.1 USBDM Configuration Interface
Table
Table 2.3 PCB layer stack
USER MANUAL
2.3. All signals are routed on top and bottom layers. The internal
Figure 2.2
5
4.25 mil, +/- 0.25 mil FR-4
4.25 mil, +/- 0.25 mil FR-4
1.8 - 3.1 mil, finished
1.8 - 3.1 mil, finished
1.3 mil (nominal)
1.3 mil (nominal)
~28 mil FR-4
Figure
with silk screen information to identify component
2.3.
Revision 1.0 (07-17-09)