EESY199 Omron, EESY199 Datasheet - Page 4

• Manufacturer Part Number: EESY199
• Description: PHOTO MICROSENSOR T/R
• Manufacturer: Omron

Specifications of EESY199

• Lead Free Status / Rohs Status: Supplier Unconfirmed

Precautions
■ Soldering Information
Reflow soldering
• Reflow no more than once.
• Adjust the amount of applied solder quantity to the product sidewall of the terminal
• When designing the pcb, avoid placing traces or other connections under the sensor, as shown in the ‘Recommend Solder Pattern’ diagram
• Set the reflow oven so that the temperature profile shown in the following chart is obtained for the upper surface of the product being soldered.
• Do not immerse the resin part of the sensor into the solder.
• The use of an infrared lamp can cause the temperature of the resin to rise too high. Test the soldering method under actual conditions and make
Storage
Store the product under the following conditions:
To protect the product from the effects of humidity until the package is opened, dry-box storage is recommended.
Reflow soldering must be done within 48 hours after opening the aluminum-laminated bag, during which time the product must be stored between
5°C and 25°C at 60% maximum humidity.
If it is necessary to store the product for more than 48 hours after opening the bag, use dry-box storage or reseal the products in the aluminum-
laminated bag with a commercially available desiccant. Then, store the sensors between 5 to 30°C at 70% max. humidity, mounting them within 2
weeks.
Baking
If a product has remained packed in the aluminum-laminated bag for six months or more, or if more than 48 hours have lapsed since the bag was
opened, then bake the product under the following conditions before use:
Note: Do not bake the sensors while they are still in their bag. Temporarily mount them to the PCB or place them in metal trays prior to baking.
Cleaning Conditions
Do not use ultrasonic cleaning.
232
Recommended Solvents Ethyl alcohol, methyl alcohol, or isopropyl alcohol
Solvent Temperature
Immersion Time
sure that the process is acceptable, because the impact on the junction between the device and the PCB varies depending upon the soldering
and cooling conditions.
(°C)
Temperature: 5 to 30°C
Humidity: 70% max.
125°C for 16 to 24 hours (max.)
250
200
150
100
50
25
Subject the sensors to the baking process no more than once.
1 to 4°C/sec
Photomicrosensor (Reflective)
120 sec MAX.
1 to 4°C/sec
Time
90 sec MAX.
60 sec MAX.
10 sec MAX.
3 hours max
45°C max
1 to 4°C/sec
EE-SY199
240°C MAX.
200°C
165°C MAX.