BAP65-02 NXP Semiconductors, BAP65-02 Datasheet - Page 9

Planar PIN diode in a SOD523 ultra small SMD plastic package

BAP65-02

Manufacturer Part Number
BAP65-02
Description
Planar PIN diode in a SOD523 ultra small SMD plastic package
Manufacturer
NXP Semiconductors
Type
Attenuator/Switchr
Datasheet

Specifications of BAP65-02

Configuration
Single
Forward Current
100mA
Forward Voltage
1.1V
Power Dissipation
715mW
Operating Temperature Classification
Military
Reverse Voltage
30V
Package Type
I-IGIA
Mounting
Surface Mount
Maximum Series Resistance @ Minimum If
0.95@5mAOhm
Maximum Series Resistance @ Maximum If
0.9@10mAOhm
Typical Carrier Life Time
170ns
Operating Temperature (max)
150C
Operating Temperature (min)
-65C
Pin Count
2
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BAP65-02
Manufacturer:
WJ
Quantity:
5 610
Part Number:
BAP65-02
Manufacturer:
NXP
Quantity:
60 000
Part Number:
BAP65-02
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
BAP65-02,115
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
BAP65-02115
Manufacturer:
NXP Semiconductors
Quantity:
27 606
NXP Semiconductors
12. Contents
1
1.1
1.2
1.3
2
3
4
5
6
7
8
9
10
10.1
10.2
10.3
10.4
11
12
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics . . . . . . . . . . . . . . . . . . 2
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 6
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 7
Contact information. . . . . . . . . . . . . . . . . . . . . . 8
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 28 September 2010
BAP65-02
Document identifier: BAP65-02
Silicon PIN diode
All rights reserved.

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