LMX9838DONGLE/NOPB National Semiconductor, LMX9838DONGLE/NOPB Datasheet - Page 27

• Manufacturer Part Number: LMX9838DONGLE/NOPB
• Manufacturer: National Semiconductor

Specifications of LMX9838DONGLE/NOPB

• Lead Free Status / Rohs Status: Compliant

PCB Land Pad Diameter
PCB Solder Mask Opening
PCB Finish (HASL details)
Stencil Aperture
Stencil Thickness
Solder Paste Used
Flux Cleaning Process
Reflow Profiles
Average Ramp-Up Rate (Ts
Preheat:
Temperature Min (Ts
Temperature Max (Ts
Time (ts
Time maintained above:
Temperature (T
Time (
Peak/Classification Temperature (Tp)
Time within 5°C of actual Peak Temperature (tp)
Ramp-Down Rate
Time 25 °C to Peak Temperature
Reflow Profiles
19.0 Soldering
The LMX9838 bumps are designed to melt as part of the Sur-
face Mount Assembly (SMA) process. In order to ensure
reflow of all solder bumps and maximum solder joint reliability
while minimizing damage to the package, recommended re-
flow profiles should be used.
Note 27: See IPC/JEDEC J-STD-020C, July 2004.
Note 28: All temperatures refer to the top side of the package, measured on the package body surface.
tL
)
MIN
to ts
L
MAX
)
)
MIN
MAX
)
Profile Feature
)
Parameter
MAX
to Tp)
TABLE 29. Classification Reflow Profiles (Note 27), (Note 28)
FIGURE 14. Typical Reflow Profiles
TABLE 28. Soldering Details
27
Table 28, Table 29 and Figure 14 provide the soldering details
required to properly solder the LMX9838 to standard PCBs.
The illustration serves only as a guide and National is not li-
able if a selected profile does not work.
See IPC/JEDEC J-STD-020C, July 2004 for more informa-
tion.
Defined by customer or manufacturing facility
Defined by customer or manufacturing facility
Defined by customer or manufacturing facility
3°C/second maximum
6°C/second maximum
8 minutes maximum
NOPB Assembly
60 – 180 seconds
60 – 150 seconds
20 – 40 seconds
See Figure 14
See Figure 14
250 + 0°C
Value
13 mil
19 mil
17 mil
150°C
200°C
217°C
5 mil
30027912
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