BSE-040-01-F-D-A-TR Samtec Inc, BSE-040-01-F-D-A-TR Datasheet

BSE-040-01-F-D-A-TR

Manufacturer Part Number

BSE-040-01-F-D-A-TR

Description

Conn Micro Socket SKT 80 POS 0.8mm Solder ST SMD T/R

Manufacturer

Samtec Inc

Type

Micro Socketr

Datasheet

1.BSE-040-01-F-D-A-TR.pdf (1 pages)

Specifications of BSE-040-01-F-D-A-TR

Pitch

0.8 mm

Number Of Rows

Number Of Contacts

Gender

SKT

Contact Plating

Gold Over Nickel

Termination Method

Solder

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

BSE-040-01-F-D-A-TR

Manufacturer:

Samtec Inc.

Quantity:

358

Current page: 1 of 1
Download datasheet (531Kb)

For complete speciﬁ cations and

recommended PCB layouts see

www.samtec.com?BTE or

www.samtec.com?BSE

Insulator Material:

Liquid Crystal Polymer

Contact Material:

Phosphor Bronze

Plating:

Au or Sn over 50µ" (1,27µm) Ni

Current Rating:

2A @ 80°C ambient

with 5mm Stack Height

Operating Temp Range:

-55°C to +125°C

Voltage Rating:

225 VAC with

5mm Stack Height

Max Cycles:

100

RoHS Compliant:

Yes

Processing:

Lead-Free Solderable:

Yes

SMT Lead Coplanarity:

(0,10mm) .004" max (020-080)

(0,15mm) .006" max (100-120)

Board Stacking:

For applications requiring more

than two connectors per board

or 80 positions or higher,

contact ipg@samtec.com

*Note: –C Plating passes

10 year MFG testing

Note: Some lengths, styles

and options are non-standard,

non-returnable.

BASIC BLADE & BEAM HEADER & SOCKET

F-211

SPECIFICATIONS

• 30µ" (0,76µm) Gold

• Edge Mount Capability

• Friction Lock option

• 11mm, 14mm, 16,10mm,

Call Samtec.

(0,80mm) .0315"

BTE, BSE SERIES

*Processing conditions will

MATED HEIGHT

19,10mm, 22mm,

25mm and 30mm Stack

Height (Caution: Some

automatic placement/

inspection machines may

have component height

restrictions. Please consult

machinery speciﬁ cations.)

affect mated height.

STYLE

APPLICATION

LEAD

–01

–02

SPECIFIC

HEIGHT*

(5,00) .197

(8,00) .315

MATED

Mates with:

BSE

Mates with:

BTE

(3,94)

BSE

.155

(6,22)

(3,05)

.245

.120

10 year Mixed Flowing Gas with 50µ" Gold

–020, –040, –060,

–080, –100, –120

No. of positions x (0,80) .0315

EXTENDED LIFE PRODUCT

Call Samtec for maximum cycles

(0,20)

.008

NO. OF POSITIONS

No. of positions x (0,80) .0315

–020, –040, –060,

–080, –100, –120

NO. OF POSITIONS

+ (4,00) .1575

(0,80) .0315

PER ROW

+ (5,27) .2075

(0,80) .0315

WWW.SAMTEC.COM

(0,15)

.006

(5,97)

.235

BTE–020–02–L–D–A

(3,25)

(0,76)

(3,81)

.128

.030

.150

STYLE

Specify

STYLE

LEAD

STYLE

LEAD

chart

(0,89)

from

–01

–02

.035

DIA

(7,24)

.285

(7,11)

(1,78)

.280

.070

(4,27)

(7,21)

BTE–080–02–F–D–A

.168

.284

(7,49)

.295

contact area, 10µ" (0,25µm) min Au over

50µ" (1,27µm) min Ni on all solder tails

50µ" (1,27µm) Ni on Ground Plane in

150µ" (3,81µm) Ni on Signal Pins in

PLATING

in contact area, 10µ" (0,25µm) min

= 10µ" (0,25µm) Gold on contact,

OPTION

= 10µ" (0,25µm) Gold on contact,

150µ" (3,81µm) Ni on Signal Pins

Matte Tin over 50µ" (1,27µm) min

Ground Plane in contact area,

= Electro-Polished Selective

contact area, Matte Tin over

= Electro-Polished Selective

Au over 50µ" (1,27µm) Ni on

(0,89)

50µ" (1,27µm) min Au over

.035

= Gold Flash on contact,

DIA

= Gold Flash on contact,

(0,76)

Ni on all solder tails

.030

Matte Tin on tail

–C*

–F

–L

–F

–L

BSE–040–01–F–D–A

• Passes

10 year MFG

= Tape & Reel

(80 positions

= Tape & Reel

(60 positions

& Place Pad

maximum)

OPTION

= (7,00mm)

OTHER

maximum)

Polyimide

OPTION

.275" DIA

Film Pick

OTHER

–TR

–K

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