BLM41PG181SN1L Murata Electronics, BLM41PG181SN1L Datasheet - Page 178
BLM41PG181SN1L
Manufacturer Part Number
BLM41PG181SN1L
Description
EMI Filter 3A Flat Style SMD
Manufacturer
Murata Electronics
Type
EMI Suppression Filterr
Datasheet
1.BLM18EG121SN1-D.pdf
(209 pages)
Specifications of BLM41PG181SN1L
Case Size
1806
Maximum Current Rating
3 A
Termination
Flat Style
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
BLM41PG181SN1L
Manufacturer:
MURATA
Quantity:
5 000
Part Number:
BLM41PG181SN1L
Manufacturer:
MURATA/村田
Quantity:
20 000
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DL
o
!Note
176
1. Standard Land Pattern Dimensions
DLM11G
DLM2HG
DLP0NS
DLP11S
DLP11T
DLP1ND
DLP2AD
DLP31S
DLP31D
DLW21S
DLW21H
DLW31SN
DLW5AH
DLW5B
PCB Warping
PCB should be designed so that products are not
subjected to the mechanical stress caused by warping
the board.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
p
Chip Common Mode Choke Coil
DLW5AH/5B
DLM2HG
DLP0NS
oReflow and Flow
oReflow Soldering
DLP2AD
0.30
0.90
0.9
2.9
5.5
0.5
0.25
1.75
1.0
4.0
DLP11S
DLM11G
DLP31S
0.55
1.95
1.5
0.5
1.0 0.6 1.0
Soldering and Mounting
Products should be located in the sideways direction
(Length: a<b) to the mechanical stress.
Poor example
Do not use gild pattern; excess soldering heat may dissolve
metal of a copper wire.
1
2
3
DLW21S/21H/31SN
DLW21S/H
DLW31SN
: If the pattern is made with wider than 1.2mm (DLW21) /
: If the pattern is made with less than 0.4mm, in the worst
: If the pattern is made with wider than 0.8mm (DLW21) /
DLP11T
1.6mm (DLW31S) it may result in components turning
around, because melting speed is different. In the worst
case, short circuit between lines may occur.
case, short circuit between lines may occur due to spread
of soldering paste or mount placing accuracy.
1.6mm (DLW31SN), the bending strength will be reduced.
Series
a
b
3
1.55
0.55
DLP31D
0.8
1.6
a
2.6
3.7
Good example
0.8 Pitch
b
DLP1ND
b
Land Pattern
+ Solder Resist
Land Pattern
Solder Resist
a
2.8
0.4
0.4
0.4
0.2
c
1.4
0.4
1.2
1.6
d
(in mm)
Mar.28,2011
C31E.pdf
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