ERJ3GEYJ204V Panasonic, ERJ3GEYJ204V Datasheet - Page 4
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ERJ3GEYJ204V
Manufacturer Part Number
ERJ3GEYJ204V
Description
THICK FILM 0603 200K OHM 5% 1/10W 200PPM
Manufacturer
Panasonic
Datasheet
1.ERJ2GEJ221X.pdf
(5 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ERJ3GEYJ204V
Manufacturer:
PANASONI
Quantity:
30 000
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In case of fl ow soldering, the land width must be smaller than the Chip Resistor width to control the sol der amount properly.
Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In case of refl ow soldering, solder
amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W).
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The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors
shown on page ER3 of this catalog.
1. Take measures against mechanical stress during and after mounting of Thick Film Chip Resistors (here af ter called the
2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations
3. Do not use halogen-based or other high-activity fl ux. Otherwise, the residue may impair the resistors' per for mance
4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a
5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing
6. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Oth er wise, the re sis tors'
7. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress.
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Recommended Land Pattern
Recommended Soldering Conditions
Recommendations and precautions are described below.
● Recommended soldering conditions for refl ow
● Recommended soldering conditions for fl ow
resistors) so as not to damage their electrodes and protective coatings.
of the resistors when installed in your products before use.
Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired.
and/or reliability.
soldering iron with a high temperature tip, fi nish soldering as quickly as possible (within three seconds at 350 °C max.).
problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder.
protective coatings and bodies may be chipped, affecting their performance.
· Refl ow soldering shall be performed a maximum of
· Please contact us for additional information when
· Please measure the temperature of the terminals
Safety Precautions
two times.
used in conditions other than those specifi ed.
and study every kind of solder and printed circuit
board for solderability be fore ac tu al use.
Preheating
Soldering
Preheating
Peak
b
a
Time
140 °C to 180 °C
Temperature
245 ± 5 °C
Chip Resistor
Heating
For soldering
60 s to 120 s
20 s to 30 s
Time
For soldering (Example : Sn/Pb)
For lead-free soldering (Example : Sn/Ag/Cu)
ERJXG (01005)
ERJ1G (0201)
ERJ2G (0402)
ERJ3G (0603)
ERJ6G (0805)
ERJ8G (1206)
ERJ14(1210)
ERJ12(1812)
ERJ12Z(2010)
ERJ1T(2512)
Preheating
Main heating
Peak
Preheating
Main heating
Peak
(inches)
Type
150 °C to 180 °C
Temperature
max. 260 °C
0.15 to 0.20
0.3 to 0.4
0.5 to 0.6
0.7 to 0.9
3.3 to 3.7
1 to 1.4
2 to 2.4
2 to 2.4
3.6 to 4
5 to 5.4
140 °C to 160 °C
150 °C to 180 °C
For lead-free soldering
Above 200 °C
Above 230 °C
a
Temperature
Temperature
max. 260 °C
235 ± 5 °C
Thick Film Chip Resistors
Dimensions (mm)
0.5 to 0.7
0.8 to 0.9
1.4 to 1.6
3.2 to 3.8
5.7 to 6.5
7.6 to 8.6
2 to 2.2
4.4 to 5
4.4 to 5
6.2 to 7
b
60 s to 120 s
max. 10 s
60 s to 120 s
60 s to 120 s
30 s to 40 s
30 s to 40 s
max. 10 s
max. 10 s
Time
Time
Time
0.20 to 0.25
0.25 to 0.35
0.4 to 0.6
0.9 to 1.4
1.2 to 1.8
1.8 to 2.8
2.3 to 3.5
1.8 to 2.8
2.3 to 3.5
0.8 to 1
Feb. 2006
c