VR37000002204FA100 Vishay, VR37000002204FA100 Datasheet - Page 4

• Manufacturer Part Number: VR37000002204FA100
• Manufacturer: Vishay

APPLICATION INFORMATION
TESTS AND REQUIREMENTS
Essentially all tests are carried out in accordance with
IEC 60115-1 specification, category LCT/UCT/56 (rated
temperature range: Lower Category Temperature, Upper
Category Temperature; damp heat, long term, 56 days).
The
IEC 60068-2-xx. Test method under standard atmospheric
conditions according to IEC 60068-1, 5.3.
Revision: 17-Aug-11
Hot-spot temperature rise (T) as a function of dissipated power
TEST PROCEDURES AND REQUIREMENTS
IEC
60115-1
CLAUSE
4.16
4.16.2
4.16.3
4.16.4
4.17
4.18
4.19
4.20
Δ T
(K)
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
80
60
40
20
tests
0
0
METHOD
are
60068-2-
21 (Ua1)
21 (Ub)
21 (Uc)
14 (Na)
29 (Eb)
20 (Ta)
20 (Tb)
TEST
www.vishay.com
IEC
carried
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
0.4
Rapid change of temperature
Robustness of terminations:
out
Bending half number
Tensile all samples
Torsion other half
soldering heat
Resistance to
Solderability
Solderability
(after aging)
of samples
of samples
in
Bump
TEST
For technical questions, contact:
0.8
accordance
P (W)
1.2
with
2 s; 235 °C: Solder bath method; SnPb40
for 2 s at 235 °C; solder bath (SnPb40)
3 x 1500 bumps in 3 directions; 40 g
3 s; 245 °C: Solder bath method;
3 x 360° in opposite directions
for 3 s at 245 °C; solder bath
Thermal shock: 10 s; 260 °C;
30 min at + 155 °C; 5 cycles
Ø 0.7 mm; load 5 N; 4 x 90°
4
Ø 0.7 mm; load 10 N; 10 s
8 h steam or 16 h 155 °C;
[e-mail]
leads immersed 6 mm;
(SnAg3Cu0.5) method
30 min at - 55 °C and
Temperature rise (T) at the lead end (soldering point) as a function
In the Test Procedures and Requirements table the tests
and requirements are listed with reference to the relevant
clauses of IEC 60115-1 and IEC 60068-2-xx test methods.
A short description of the test procedure is also given. In
some instances deviations from the IEC recommendations
were necessary for our method of specifying.
All soldering tests are performed with mildly activated flux.
3 mm from body
PROCEDURE
SnAg3Cu0.5
of dissipated power at various lead lengths after mounting
∆ T
(K)
50
40
30
20
10
0
0
www.vishay.com/doc?91000
0.4
Vishay BCcomponents
Good tinning ( 95 % covered);
Good tinning (95 % covered);
Number of failures < 10 x 10
Number of failures < 10 x 10
R max.: ± (0.5 % R + 0.05 )
R max.: ± (0.5 % R + 0.05 )
R max.: ± (0.5 % R + 0.05 )
R max.: ± (0.5 % R + 0.05 )
5 mm
10 mm
15 mm
REQUIREMENTS
Document Number: 28733
0.8
No damage
No damage
no damage
no damage
P (W)
VR37
1.2
-6
-6