CL10C101JB81PNC SAMSUNG, CL10C101JB81PNC Datasheet - Page 2

• Manufacturer Part Number: CL10C101JB81PNC
• Manufacturer: SAMSUNG
• Series: CLr

Specifications of CL10C101JB81PNC

• Size: 0603
• Dielectric: C0G
• Tolerance: +/- 5%
• Voltage: 50V
• Thickness: 0.80
• Products: Automotive

External Visual
Physical Dimensions Within the specified dimensions
Mechanical Shock
Vibration
Resistance to
Solder Heat
Thermal Shock
ESD
Solderability
Electrical
Characterization
Board Flex
Terminal
Strength(SMD)
Beam Load
Temperature
Characterisitcs
C. Recommended Soldering method :
* For the more detail Specification, Please refer to the Samsung MLCC catalogue.
Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max )
Meet IPC/JEDEC J-STD-020 D Standard
No abnormal exterior appearance
Appearance : No abnormal exterior appearance
Capacitance Change :
Q, IR : initial spec.
Appearance : No abnormal exterior appearance
Capacitance Change :
Q, IR : initial spec.
Appearance : No abnormal exterior appearance
Capacitance Change :
Q, IR : initial spec.
Appearance : No abnormal exterior appearance
Capacitance Change :
Q, IR : initial spec.
Appearance : No abnormal exterior appearance
Capacitance Change :
Q, IR : initial spec.
95% of the terminations is to be soldered
evenly and continuously
Capacitance : Within specified tolerance
Q :
IR(25℃) : More than 100,000㏁ or 1,000㏁×㎌
IR(125℃) : More than10,000㏁ or 100㏁×㎌
Dielectric Strength
Appearance : No abnormal exterior appearance
Capacitance Change :
Appearance : No abnormal exterior appearance
Capacitance Change :
Destruction value should not be exceed
Chip Length < 2.5㎜
a) Chip Thickness > 0.5㎜ : 20N
b) Chip Thickness ≤ 0.5㎜ : 8N
C0G
(From -55℃ to 125℃, Capacitance change shoud be within ±30PPM/℃)
within ±2.5% or ±0.25㎊ whichever is larger
within ±2.5% or ±0.25㎊ whichever is larger
within ±2.5% or ±0.25㎊ whichever is larger
within ±2.5% or ±0.25㎊ whichever is larger
within ±2.5% or ±0.25㎊ whichever is larger
within ±5.0% or ±0.5㎊ whichever is larger
within ±2.5% or ±0.25㎊ whichever is larger
1000
Whichever is Smaller
max.
Performance
Microscope (´10)
Using The calipers
Three shocks in each direction should be applied along
3 mutually perpendicular axes of the test specimen (18 shocks)
5g's for 20min., 12cycles each of 3 orientations,
Use 8"×5" PCB 0.031" Thick 7 secure points on one long side
and 2 secure points at corners of opposite sides. Parts mounted
within 2" from any secure point. Test from 10~2000㎐.
Solder pot : 260±5℃, 10±1sec.
-55℃/+125℃.
Note: Number of cycles required-300,
Maximum transfer time-20 sec, Dwell time-15min. Air-Air
AEC-Q200-002
a) Preheat at 155℃ for 4 hours, Immerse in solder for 5s at 245±5 ℃
b) Steam aging for 8 hours, Immerse in solder for 5s at 245±5 ℃
c) Steam aging for 8 hours, Immerse in solder for 120s at 260±5 ℃
solder : a solution ethanol and rosin
The Capacitance /Q should be measured at 25 ℃,
1㎒±10%, 0.5~5Vrms
I.R. should be measured with a DC voltage not exceeding
Rated Voltage @25℃, @125℃ for 60~120 sec.
Dielectric Strength : 250% of the rated voltage for 1~5 seconds
Bending to the limit (3㎜) for 5 seconds
10N, for 60±1 sec.
Beam speed
0.5±0.05㎜/sec
Peakvalue
1,500G
Duration
0.5ms
Test condition
Half sine
Wave
4.7m/sec.
Velocity