Mechanical Data
Features
Maximum Ratings and Electrical Characteristics
Thermal Characteristics
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage (Note 5)
RMS Reverse Voltage
Average Rectified Output Current
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
Maximum Forward Voltage Drop
Peak Reverse Current
at Rated DC Blocking Voltage (Note 5)
Maximum Reverse Recovery Time (Note 4)
Typical Total Capacitance (f = 1MHz, V
Power Dissipation (Note 1)
Thermal Resistance Junction to Ambient (Note 1)
Thermal Resistance Junction to Soldering Point (Note 3)
Operating and Storage Temperature Range
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Notes:
DS30784 Rev. 2 - 2
PowerDI is a registered trademark of Diodes Incorporated.
Glass Passivated Die Construction
Super-Fast Recovery Time for High Efficiency
Low Forward Voltage Drop and High Current Capability
Patented Interlocking Clip Design for High Surge Current
Capacity
Lead Free Finish, RoHS Compliant (Note 2)
"Green" Molding Compound (No Br, Sb)
Qualified to AEC-Q101 Standards for High Reliability
Case: PowerDI
Case Material: Molded Plastic, "Green" Molding
Compound. UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminal Connections: Cathode Band
Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
Marking & Type Code Information: See Page 3
Ordering Information: See Page 3
Weight: 0.011 grams (approximate)
2. RoHS revision 13.2.2003. Glass and high temperature solder exemptions applied, see EU Directive Annex Notes 5 and 7.
3. Theoretical R
4. Measured with I
5. Short duration pulse test used to minimize self-heating effect.
6. Device mounted on FR-4 PCB, 2oz. Cu pad layout as shown on Diodes Inc. suggested pad layout document AP02001.pdf. (see page 2)
1. Device mounted on 1" x 1", Polymide PCB; 2 oz. Cu pad layout as shown on Diodes Inc. suggested pad layout document AP02001.pdf.
®
123
θJS
F
calculated from the top center of the die straight down to the PCB cathode tab solder junction.
Characteristic
= 0.5A, I
Characteristic
R
= 1.0A, I
R
= 4VDC)
rr
= 0.25A. See figure 5.
@T
@I
@T
@T
@T
F
A
A
A
A
= 1.0A
= 25°C
= 25°C
= 100°C
= 25°C
www.diodes.com
C
E
D
1 of 3
L
Symbol
T
j,
R
R
L4
P
T
θ JA
θ JS
D
STG
Symbol
V
V
V
R(RMS)
I
V
A
B
A
I
FSM
RWM
V
C
1.0A SURFACE MOUNT SUPER-FAST RECTIFIER
RRM
I
RM
t
FM
O
rr
R
T
L1
@T
L2
L3
A
= 25°C unless otherwise specified
L
E
H
Typ
117
⎯
⎯
-65 to +150
Value
1.25
400
280
1.0
5.0
200
30
25
14
Dim
L1
L2
L3
L4
All Dimensions in mm
DFLU1400
A
B
C
D
E
H
L
Max
1.0
⎯
PowerDI
6
3.50
2.60
1.63
0.93
0.85
0.15
0.45
0.90
Min
—
—
—
PowerDI
Max
3.90
3.00
1.93
1.00
1.25
0.25
0.85
1.30
© Diodes Incorporated
®
—
—
—
123
Unit
μA
pF
ns
V
V
A
A
V
DFLU1400
3.70
2.80
1.78
0.98
1.00
0.20
0.65
1.35
1.10
0.20
1.05
Typ
°C/W
°C/W
Unit
°C
W
®
123