AD7397ARU-REEL7 Analog Devices Inc, AD7397ARU-REEL7 Datasheet - Page 5

• Manufacturer Part Number: AD7397ARU-REEL7
• Description: IC DAC 10BIT PARALLEL 3V 24TSSOP
• Manufacturer: Analog Devices Inc

Specifications of AD7397ARU-REEL7

• Rohs Status: RoHS non-compliant
• Settling Time: 60µs
• Number Of Bits: 10
• Data Interface: Parallel
• Number Of Converters: 2
• Voltage Supply Source: Single Supply
• Power Dissipation (max): 1mW
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 24-TSSOP

REV. 0
ABSOLUTE MAXIMUM RATINGS*
V
V
Logic Inputs to GND . . . . . . . . . . . . . . . . . . . . . –0.3 V, +8 V
V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +2 V
I
Package Power Dissipation . . . . . . . . . . . . . (T
Thermal Resistance
Model
AD7396AN
AD7396AR
AD7397AN
AD7397AR
AD7397ARU
The AD7396/AD7397 contains 1365 transistors. The die size measures 89 mil
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7396/AD7397 features proprietary ESD protection circuitry, permanent dam-
age may occur on devices subjected to high energy electrostatic discharges. Therefore, proper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
OUT
DD
REF
OUT
24-Lead Plastic DIP Package (N-24) . . . . . . . . . . +63 C/W
24-Lead SOIC Package (R-24) . . . . . . . . . . . . . . . +70 C/W
24-Lead Thin Shrink Surface Mount (RU-24) . . +143 C/W
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +8 V
Short Circuit to GND . . . . . . . . . . . . . . . . . . . . +50 mA
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, V
to GND . . . . . . . . . . . . . . . . . . . . . –0.3 V, V
Res
(LSB)
12
12
10
10
10
JA
–40 C to +85 C
–40 C to +85 C
–40 C to +125 C
–40 C to +125 C
–40 C to +85 C
Temperature
Ranges
J
max – T
DD
+ 0.3 V
ORDERING GUIDE
A
)/
DD
Package
Descriptions
24-Lead P-DIP
24-Lead SOIC
24-Lead P-DIP
24-Lead SOIC
24-Lead Thin Shrink Small Outline Package (TSSOP)
JA
–5–
106 mil = 9434 sq mil.
Maximum Junction Temperature (T
Operating Temperature Range . . . . . . . . . . . –40 C to +85 C
Storage Temperature Range . . . . . . . . . . . . –65 C to +150 C
Lead Temperature
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
N-24 (Soldering, 10 sec) . . . . . . . . . . . . . . . . . . . . . . +300 C
R-24 (Vapor Phase, 60 sec) . . . . . . . . . . . . . . . . . . . . +215 C
RU-24 (Infrared, 15 sec) . . . . . . . . . . . . . . . . . . . . . . +224 C
AD7397AN, AD7397AR Only . . . . . . . . –40 C to +125 C
AD7396/AD7397
WARNING!
J
max) . . . . . . . . . +150 C
ESD SENSITIVE DEVICE
Package
Options
N-24
R-24
N-24
R-24
RU-24