EPM2210GF256C5 Altera, EPM2210GF256C5 Datasheet - Page 12
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EPM2210GF256C5
Manufacturer Part Number
EPM2210GF256C5
Description
IC MAX II CPLD 2210 LE 256-FBGA
Manufacturer
Altera
Series
MAX® IIr
Specifications of EPM2210GF256C5
Programmable Type
In System Programmable
Delay Time Tpd(1) Max
7.0ns
Voltage Supply - Internal
1.71 V ~ 1.89 V
Number Of Logic Elements/blocks
2210
Number Of Macrocells
1700
Number Of I /o
204
Operating Temperature
0°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
256-FBGA
Voltage
1.8V
Memory Type
FLASH
Number Of Logic Elements/cells
2210
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Other names
544-1348
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
EPM2210GF256C5N
Manufacturer:
SIEMENS
Quantity:
342
2–4
Logic Array Blocks
Figure 2–3. MAX II LAB Structure
Note to
(1) Only from LABs adjacent to IOEs.
LAB Interconnects
MAX II Device Handbook
Fast I/O connection
to IOE (1)
DirectLink
interconnect from
adjacent LAB
or IOE
DirectLink
interconnect to
adjacent LAB
or IOE
Figure
2–3:
Each LAB consists of 10 LEs, LE carry chains, LAB control signals, a local interconnect,
a look-up table (LUT) chain, and register chain connection lines. There are 26 possible
unique inputs into an LAB, with an additional 10 local feedback input lines fed by LE
outputs in the same LAB. The local interconnect transfers signals between LEs in the
same LAB. LUT chain connections transfer the output of one LE’s LUT to the adjacent
LE for fast sequential LUT connections within the same LAB. Register chain
connections transfer the output of one LE’s register to the adjacent LE’s register
within an LAB. The Quartus
adjacent LABs, allowing the use of local, LUT chain, and register chain connections
for performance and area efficiency.
The LAB local interconnect can drive LEs within the same LAB. The LAB local
interconnect is driven by column and row interconnects and LE outputs within the
same LAB. Neighboring LABs, from the left and right, can also drive an LAB’s local
interconnect through the DirectLink connection. The DirectLink connection feature
minimizes the use of row and column interconnects, providing higher performance
and flexibility. Each LE can drive 30 other LEs through fast local and DirectLink
interconnects.
Logic Element
Figure 2–4
LE0
LE1
LE2
LE3
LE4
LE5
LE6
LE7
LE8
LE9
LAB
shows the DirectLink connection.
®
II software places associated logic within an LAB or
Figure 2–3
Local Interconnect
Row Interconnect
shows the MAX II LAB.
© October 2008 Altera Corporation
Chapter 2: MAX II Architecture
Column Interconnect
Fast I/O connection
to IOE (1)
DirectLink
interconnect from
adjacent LAB
or IOE
DirectLink
interconnect to
adjacent LAB
or IOE
Logic Array Blocks