EPM2210F324C5N Altera, EPM2210F324C5N Datasheet - Page 3
![IC MAX II CPLD 2210 LE 324-FBGA](/photos/6/70/67067/544-324-fbga_sml.jpg)
EPM2210F324C5N
Manufacturer Part Number
EPM2210F324C5N
Description
IC MAX II CPLD 2210 LE 324-FBGA
Manufacturer
Altera
Series
MAX® IIr
Specifications of EPM2210F324C5N
Programmable Type
In System Programmable
Delay Time Tpd(1) Max
7.0ns
Voltage Supply - Internal
2.5V, 3.3V
Number Of Logic Elements/blocks
2210
Number Of Macrocells
1700
Number Of I /o
272
Operating Temperature
0°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
324-FBGA
Voltage
2.5V, 3.3V
Memory Type
FLASH
Number Of Logic Elements/cells
2210
Family Name
MAX II
# Macrocells
1700
Frequency (max)
1.8797GHz
Propagation Delay Time
11.2ns
Number Of Logic Blocks/elements
221
# I/os (max)
272
Operating Supply Voltage (typ)
2.5/3.3V
In System Programmable
Yes
Operating Supply Voltage (min)
2.375V
Operating Supply Voltage (max)
3.6V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
324
Package Type
FBGA
For Use With
P0305 - KIT MAX II MICRO
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Compliant
Other names
544-1961
EPM2210F324C5N
EPM2210F324C5N
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
EPM2210F324C5N
Manufacturer:
ALTERA
Quantity:
453
Part Number:
EPM2210F324C5N
Manufacturer:
ALTERA/阿尔特拉
Quantity:
20 000
Chapter 1: Introduction
Features
Table 1–3. MAX II Packages and User I/O Pins
Table 1–4. MAX II TQFP, FineLine BGA, and Micro FineLine BGA Package Sizes
© August 2009 Altera Corporation
EPM240
EPM240G
EPM570
EPM570G
EPM1270
EPM1270G
EPM2210
EPM2210G
EPM240Z
EPM570Z
Note to
(1) Packages available in lead-free versions only.
Pitch (mm)
Area (mm2)
Length × width
(mm × mm)
Device
Package
Table
1–3:
FineLine
BGA
68-Pin
Micro
FineLine
—
—
—
—
54
—
68-Pin
Micro
5 × 5
BGA
(1)
0.5
25
MAX II devices are available in space-saving FineLine BGA, Micro FineLine BGA,
and thin quad flat pack (TQFP) packages (refer to
devices support vertical migration within the same package (for example, you can
migrate between the EPM570, EPM1270, and EPM2210 devices in the 256-pin
FineLine BGA package). Vertical migration means that you can migrate to devices
whose dedicated pins and JTAG pins are the same and power pins are subsets or
supersets for a given package across device densities. The largest density in any
package has the highest number of power pins; you must lay out for the largest
planned density in a package to provide the necessary power pins for migration. For
I/O pin migration across densities, cross reference the available I/O pins using the
device pin-outs for all planned densities of a given package type to identify which
I/O pins can be migrated. The Quartus
and place all pins for you when given a device migration list.
FineLine
100-Pin
BGA
Micro
FineLine
100-Pin
80
76
—
—
80
76
Micro
6 × 6
BGA
0.5
(1)
36
FineLine
100-Pin
FineLine
BGA
100-Pin
11 × 11
80
76
—
—
—
—
BGA
121
1
100-Pin
TQFP
100-Pin
16 × 16
80
76
—
—
—
—
TQFP
256
0.5
144-Pin
TQFP
116
116
144-Pin
22 × 22
—
—
—
—
TQFP
484
0.5
®
II software can automatically cross-reference
FineLine
144-Pin
BGA
Micro
FineLine
144-Pin
116
Micro
—
—
—
—
—
7 × 7
BGA
0.5
49
(1)
Table 1–3
FineLine
256-Pin
BGA
FineLine
256-Pin
Micro
11 × 11
Micro
160
212
160
BGA
—
—
—
121
0.5
and
(1)
Table
FineLine
FineLine
256-Pin
256-Pin
17 × 17
MAX II Device Handbook
BGA
160
212
204
BGA
289
—
—
—
1
1–4). MAX II
FineLine
324-Pin
FineLine
324-Pin
19 × 19
BGA
272
BGA
361
—
—
—
—
—
1
1–3