DSPB56725AF Freescale Semiconductor, DSPB56725AF Datasheet - Page 9

• Manufacturer Part Number: DSPB56725AF
• Description: DSP 24BIT AUD 250MHZ 80-LQFP
• Manufacturer: Freescale Semiconductor
• Series: Symphony™r
• Type: Audio Processorr

Specifications of DSPB56725AF

• Interface: Host Interface, I²C, SAI, SPI
• Clock Rate: 250MHz
• Non-volatile Memory: External
• On-chip Ram: 112kB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.20V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 80-LQFP
• Processor Series: DSP567xx
• Core: 56300
• Leaded Process Compatible: Yes
• Rohs Compliant: Yes
• Peak Reflow Compatible (260 C): Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

2.2
Table 3
The average chip-junction temperature (T
Where:
For most applications, P
780 mA. See
To find T
Freescale Semiconductor
Natural Convection, Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
2, Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3. Thermal resistance between the die and the case top surface as measured by the cold plate method
Storage temperature
ESD protected voltage (Human Body Model)
ESD protected voltage (Charged Device)
Note:
1. GND = 0 V, T
2. Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not guaranteed. Stress
3. If the power supply ramp to full supply time is longer than 10 ms, the POR circuitry will not operate correctly, causing
• All pins
• Corner pins
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
(MIL SPEC-883 Method 1012.1).
•
•
•
•
•
beyond the maximum rating may affect device reliability or cause permanent damage to the device.
erroneous operation.
provides the thermal characteristics for the device.
T
θ
P
P
P
J
JMA
A
D
INT
I/O
at 100° C
Thermal Characteristics
= Ambient Temperature, °C
= P
= Power Dissipation on Input and Output Pins—User Determined
= Package Thermal Resistance, Junction-to-Ambient, °C/W
Table 4
= I
INT
DD
J
+ P
= –40° C to 100° C, CL = 50 pF
× V
,
using the worst-case conditions and a four-layer board:
for more information.
I/O
DD
I/O
Rating
Symphony
Characteristic
, Watts – Chip Internal Power
< P
INT
1
and can be ignored. P
3
™
DSP56720/DSP56721 Multi-Core Audio Processors, Rev. 5
Table 2. Maximum Ratings (Continued)
J
) in °C can be obtained from:
Table 3. Thermal Characteristics
T
J
= T
D
can be calculated using the worst-case conditions of 1.1 V and
A
Symbol
1,2
+ (P
T
STG
—
—
D
×
Single layer board
(1s)
Four layer board
(2s2p)
θ
JMA
Board Type
)
—
–65 to +150
R
R
Value
Symbol
θJC
θJA
2000
500
750
or θ
or θ
1, 2
JA
JC
57 for 80 QFP
49 for 144 QFP
44 for 80 QFP
40 for 144 QFP
10 for 80 QFP
9 for 144 QFP
LQFP Values
Unit
°
V
V
C
°
°
°
Unit
C/W
C/W
C/W
9