DSPB56725AF Freescale Semiconductor, DSPB56725AF Datasheet - Page 9
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DSPB56725AF
Manufacturer Part Number
DSPB56725AF
Description
DSP 24BIT AUD 250MHZ 80-LQFP
Manufacturer
Freescale Semiconductor
Series
Symphony™r
Type
Audio Processorr
Specifications of DSPB56725AF
Interface
Host Interface, I²C, SAI, SPI
Clock Rate
250MHz
Non-volatile Memory
External
On-chip Ram
112kB
Voltage - I/o
3.30V
Voltage - Core
1.20V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
80-LQFP
Processor Series
DSP567xx
Core
56300
Leaded Process Compatible
Yes
Rohs Compliant
Yes
Peak Reflow Compatible (260 C)
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPB56725AF
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
2.2
Table 3
The average chip-junction temperature (T
Where:
For most applications, P
780 mA. See
To find T
Freescale Semiconductor
Natural Convection, Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
2, Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3. Thermal resistance between the die and the case top surface as measured by the cold plate method
Storage temperature
ESD protected voltage (Human Body Model)
ESD protected voltage (Charged Device)
Note:
1. GND = 0 V, T
2. Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not guaranteed. Stress
3. If the power supply ramp to full supply time is longer than 10 ms, the POR circuitry will not operate correctly, causing
• All pins
• Corner pins
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
(MIL SPEC-883 Method 1012.1).
•
•
•
•
•
beyond the maximum rating may affect device reliability or cause permanent damage to the device.
erroneous operation.
provides the thermal characteristics for the device.
T
θ
P
P
P
J
JMA
A
D
INT
I/O
at 100° C
Thermal Characteristics
= Ambient Temperature, °C
= P
= Power Dissipation on Input and Output Pins—User Determined
= Package Thermal Resistance, Junction-to-Ambient, °C/W
Table 4
= I
INT
DD
J
+ P
= –40° C to 100° C, CL = 50 pF
× V
,
using the worst-case conditions and a four-layer board:
for more information.
I/O
DD
I/O
Rating
Symphony
Characteristic
, Watts – Chip Internal Power
< P
INT
1
and can be ignored. P
3
™
DSP56720/DSP56721 Multi-Core Audio Processors, Rev. 5
Table 2. Maximum Ratings (Continued)
J
) in °C can be obtained from:
Table 3. Thermal Characteristics
T
J
= T
D
can be calculated using the worst-case conditions of 1.1 V and
A
Symbol
1,2
+ (P
T
STG
—
—
D
×
Single layer board
(1s)
Four layer board
(2s2p)
θ
JMA
Board Type
)
—
–65 to +150
R
R
Value
Symbol
θJC
θJA
2000
500
750
or θ
or θ
1, 2
JA
JC
57 for 80 QFP
49 for 144 QFP
44 for 80 QFP
40 for 144 QFP
10 for 80 QFP
9 for 144 QFP
LQFP Values
Unit
°
V
V
C
°
°
°
Unit
C/W
C/W
C/W
9