KMSC8122TMP6400 Freescale Semiconductor, KMSC8122TMP6400 Datasheet - Page 14
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KMSC8122TMP6400
Manufacturer Part Number
KMSC8122TMP6400
Description
DSP 16BIT QUAD CORE 431-FCPBGA
Manufacturer
Freescale Semiconductor
Series
MSC81xx StarCorer
Type
SC140 Corer
Specifications of KMSC8122TMP6400
Interface
DSI, Ethernet, RS-232
Clock Rate
400MHz
Non-volatile Memory
External
On-chip Ram
1.436MB
Voltage - I/o
3.30V
Voltage - Core
1.20V
Operating Temperature
-40°C ~ 105°C
Mounting Type
Surface Mount
Package / Case
431-FCPBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
KMSC8122TMP6400
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Company:
Part Number:
KMSC8122TMP6400V
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Electrical Characteristics
2.2
Table 3 lists recommended operating conditions. Proper device operation outside of these conditions is not guaranteed.
2.3
Table 4 describes thermal characteristics of the MSC8122 for the FC-PBGA packages.
Section 3.5, Thermal Considerations provides a detailed explanation of these characteristics.
14
Junction-to-ambient
Junction-to-ambient, four-layer board
Junction-to-board (bottom)
Junction-to-case
Junction-to-package-top
Notes:
Core and PLL supply voltage:
• Standard
• Reduced (300 and 400 MHz)
I/O supply voltage
Input voltage
Operating temperature range:
• Standard
• Extended
— 400 MHz
— 500 MHz
1.
2.
3.
4.
5.
6.
Recommended Operating Conditions
Thermal Characteristics
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD 51-8. Board temperature is measured on
the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
5
1, 2
Characteristic
6
4
Rating
MSC8122 Quad Digital Signal Processor Data Sheet, Rev. 16
1, 3
Table 4. Thermal Characteristics for the MSC8122
Table 3. Recommended Operating Conditions
Symbol
R
R
R
R
Ψ
θJC
θJA
θJA
θJB
JT
Symbol
V
V
CCSYN
V
V
DDH
T
T
DD
IN
Convection
J
J
Natural
0.9
26
19
9
1
20
FC-PBGA
×
–0.2 to V
20 mm
3.135 to 3.465
1.14 to 1.26
1.16 to 1.24
1.07 to 1.13
–40 to 105
0 to 90
(1 m/s) airflow
Value
200 ft/min
5
DDH
Freescale Semiconductor
21
15
+0.2
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
°C
°C
V
V
V
V
V