EP3C10F256C6N Altera, EP3C10F256C6N Datasheet - Page 2
EP3C10F256C6N
Manufacturer Part Number
EP3C10F256C6N
Description
IC CYCLONE III FPGA 10K 256-FBGA
Manufacturer
Altera
Series
Cyclone® IIIr
Datasheets
1.EP3C5F256C8N.pdf
(5 pages)
2.EP3C5F256C8N.pdf
(34 pages)
3.EP3C5F256C8N.pdf
(66 pages)
4.EP3C5F256C8N.pdf
(14 pages)
5.EP3C5F256C8N.pdf
(76 pages)
Specifications of EP3C10F256C6N
Number Of Logic Elements/cells
10320
Number Of Labs/clbs
645
Total Ram Bits
423936
Number Of I /o
182
Voltage - Supply
1.15 V ~ 1.25 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
256-FBGA
For Use With
544-2601 - KIT DEV CYCLONE III LS EP3CLS200544-2411 - KIT DEV NIOS II CYCLONE III ED.
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Other names
544-2413
EP3C10F256C6N
EP3C10F256C6N
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
EP3C10F256C6N
Manufacturer:
ALTERA
Quantity:
650
Part Number:
EP3C10F256C6N
Manufacturer:
ALTERA/阿尔特拉
Quantity:
20 000
1–2
Design Security Feature
Increased System Integration
Cyclone III Device Handbook, Volume 1
Cyclone III LS devices offer the following design security features:
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Configuration security using advanced encryption standard (AES) with 256-bit
volatile key
Routing architecture optimized for design separation flow with the Quartus
software
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Ability to disable external JTAG port
Error Detection (ED) Cycle Indicator to core
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Ability to clear contents of the FPGA logic, CRAM, embedded memory, and
AES key
Internal oscillator enables system monitor and health check capabilities
High memory-to-logic and multiplier-to-logic ratio
High I/O count, low-and mid-range density devices for user I/O constrained
applications
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Four phase-locked loops (PLLs) per device provide robust clock management and
synthesis for device clock management, external system clock management, and
I/O interfaces
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Remote system upgrade without the aid of an external controller
Dedicated cyclical redundancy code checker circuitry to detect single-event upset
(SEU) issues
Nios
custom-fit embedded processing solutions
Design separation flow achieves both physical and functional isolation
between design partitions
Provides a pass or fail indicator at every ED cycle
Provides visibility over intentional or unintentional change of configuration
random access memory (CRAM) bits
Adjustable I/O slew rates to improve signal integrity
Supports I/O standards such as LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X,
LVPECL, bus LVDS (BLVDS), LVDS, mini-LVDS, RSDS, and PPDS
Supports the multi-value on-chip termination (OCT) calibration feature to
eliminate variations over process, voltage, and temperature (PVT)
Five outputs per PLL
Cascadable to save I/Os, ease PCB routing, and reduce jitter
Dynamically reconfigurable to change phase shift, frequency multiplication or
division, or both, and input frequency in the system without reconfiguring the
device
®
II embedded processor for Cyclone III device family, offering low cost and
Chapter 1: Cyclone III Device Family Overview
© December 2009 Altera Corporation
Cyclone III Device Family Features
®
II