EPF10K20TC144-4N Altera, EPF10K20TC144-4N Datasheet - Page 11

• Manufacturer Part Number: EPF10K20TC144-4N
• Description: IC FLEX 10K FPGA 20K 144-TQFP
• Manufacturer: Altera
• Series: FLEX-10K®r

Specifications of EPF10K20TC144-4N

• Number Of Logic Elements/cells: 1152
• Number Of Labs/clbs: 144
• Total Ram Bits: 12288
• Number Of I /o: 102
• Number Of Gates: 63000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 144-TQFP, 144-VQFP
• Family Name: FLEX 10K
• Number Of Usable Gates: 20000
• Number Of Logic Blocks/elements: 1152
• # I/os (max): 102
• Frequency (max): 125MHz
• Process Technology: CMOS
• Operating Supply Voltage (typ): 5V
• Logic Cells: 1152
• Ram Bits: 12288
• Device System Gates: 63000
• Operating Supply Voltage (min): 4.75V
• Operating Supply Voltage (max): 5.25V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: TQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 544-2219

Altera Corporation
Larger blocks of RAM are created by combining multiple EABs. For
example, two 256
256 16 RAM block; two 512
a 512 8 RAM block. See
Figure 3. Examples of Combining EABs
If necessary, all EABs in a device can be cascaded to form a single RAM
block. EABs can be cascaded to form RAM blocks of up to 2,048 words
without impacting timing. Altera’s software automatically combines
EABs to meet a designer’s RAM specifications.
EABs provide flexible options for driving and controlling clock signals.
Different clocks can be used for the EAB inputs and outputs. Registers can
be independently inserted on the data input, EAB output, or the address
and WE inputs. The global signals and the EAB local interconnect can drive
the WE signal. The global signals, dedicated clock pins, and EAB local
interconnect can drive the EAB clock signals. Because the LEs drive the
EAB local interconnect, the LEs can control the WE signal or the EAB clock
signals.
Each EAB is fed by a row interconnect and can drive out to row and
column interconnects. Each EAB output can drive up to two row channels
and up to two column channels; the unused row channel can be driven by
other LEs. This feature increases the routing resources available for EAB
outputs. See
256
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
256
8
8
Figure
256
8 RAM blocks can be combined to form a
4.
16
Figure
4 blocks of RAM can be combined to form
3.
512
512
512
8
11