EPF6016QI208-3N Altera, EPF6016QI208-3N Datasheet - Page 25

IC FLEX 6000 FPGA 16K 208-PQFP

EPF6016QI208-3N

Manufacturer Part Number
EPF6016QI208-3N
Description
IC FLEX 6000 FPGA 16K 208-PQFP
Manufacturer
Altera
Series
FLEX 6000r
Datasheet

Specifications of EPF6016QI208-3N

Number Of Logic Elements/cells
1320
Number Of Labs/clbs
132
Number Of I /o
171
Number Of Gates
16000
Voltage - Supply
4.5 V ~ 5.5 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
208-MQFP, 208-PQFP
Family Name
FLEX 6000
Number Of Usable Gates
16000
Number Of Logic Blocks/elements
1320
# I/os (max)
171
Frequency (max)
125MHz
Process Technology
SRAM
Operating Supply Voltage (typ)
5V
Logic Cells
1320
Device System Gates
16000
Operating Supply Voltage (min)
4.5V
Operating Supply Voltage (max)
5.5V
Operating Temp Range
-40C to 100C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
208
Package Type
PQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Total Ram Bits
-
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
EPF6016QI208-3N
Manufacturer:
Altera
Quantity:
10 000
Part Number:
EPF6016QI208-3N
Manufacturer:
ALTERA
0
Figure 14. IOE Connection to Column Interconnect
SameFrame
Pin-Outs
Altera Corporation
Any LE can drive a
pin through the row
and local interconnect.
FastFLEX I/O: An
LE can drive a
pin through a local
interconnect for faster
clock-to-output times.
3.3-V FLEX 6000 devices support the SameFrame pin-out feature for
FineLine BGA packages. The SameFrame pin-out feature is the
arrangement of balls on FineLine BGA packages such that the lower-ball-
count packages form a subset of the higher-ball-count packages.
SameFrame pin-outs provide the flexibility to migrate not only from
device to device within the same package, but also from one package to
another. A given printed circuit board (PCB) layout can support multiple
device density/package combinations. For example, a single board layout
can support an EPF6016A device in a 100-pin FineLine BGA package or an
EPF6024A device in a 256-pin FineLine BGA package.
The Altera software packages provide support to design PCBs with
SameFrame pin-out devices. Devices can be defined for present and future
use. The Altera software packages generate pin-outs describing how to lay
out a board to take advantage of this migration (see
Row Interconnect
IOE
Each IOE can drive two
column interconnect channels.
Each IOE data and OE signal is
driven to a local interconnect.
FLEX 6000 Programmable Logic Device Family Data Sheet
LAB
IOE
Column Interconnect
Figure
15).
25

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