XC2V40-5CSG144C Xilinx Inc, XC2V40-5CSG144C Datasheet - Page 16
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XC2V40-5CSG144C
Manufacturer Part Number
XC2V40-5CSG144C
Description
IC FPGA VIRTEX-II 40K 144-CSBGA
Manufacturer
Xilinx Inc
Series
Virtex™-IIr
Datasheet
1.XC2V250-4FGG256C.pdf
(318 pages)
Specifications of XC2V40-5CSG144C
Number Of Labs/clbs
64
Total Ram Bits
73728
Number Of I /o
88
Number Of Gates
40000
Voltage - Supply
1.425 V ~ 1.575 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
144-TFBGA, CSPBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Logic Elements/cells
-
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Digitally Controlled Impedance (DCI)
Today’s chip output signals with fast edge rates require ter-
mination to prevent reflections and maintain signal integrity.
High pin count packages (especially ball grid arrays) can
not accommodate external termination resistors.
Virtex-II XCITE DCI provides controlled impedance drivers
and on-chip termination for single-ended and differential
I/Os. This eliminates the need for external resistors, and
improves signal integrity. The DCI feature can be used on
any IOB by selecting one of the DCI I/O standards.
When applied to inputs, DCI provides input parallel termina-
tion. When applied to outputs, DCI provides controlled
impedance drivers (series termination) or output parallel
termination.
DCI operates independently on each I/O bank. When a DCI
I/O standard is used in a particular I/O bank, external refer-
ence resistors must be connected to two dual-function pins
on the bank. These resistors, voltage reference of N transis-
tor (VRN) and the voltage reference of P transistor (VRP)
are shown in
When used with a terminated I/O standard, the value of
resistors are specified by the standard (typically 50Ω).
When used with a controlled impedance driver, the resistors
set the output impedance of the driver within the specified
range (25Ω to 100Ω). For all series and parallel termina-
tions listed in
must have the same value for any given bank. One percent
resistors are recommended.
The DCI system adjusts the I/O impedance to match the two
external reference resistors, or half of the reference resis-
tors, and compensates for impedance changes due to volt-
age and/or temperature fluctuations. The adjustment is
done by turning parallel transistors in the IOB on or off.
DS031-2 (v3.5) November 5, 2007
Product Specification
R
Figure 9: DCI in a Virtex-II Bank
Figure
Table 6
1 Bank
DCI
DCI
DCI
DCI
9.
and
VRN
VRP
Table
V CCO
7, the reference resistors
GND
DS031_50_101200
R
R
REF
REF
(1%)
(1%)
www.xilinx.com
Controlled Impedance Drivers (Series Term.)
DCI can be used to provide a buffer with a controlled output
impedance. It is desirable for this output impedance to
match the transmission line impedance (Z
buffers also support LVDCI and LVDCI_DV2 I/O standards.
Table 6: SelectI/O-Ultra Controlled Impedance Buffers
Controlled Impedance Drivers (Parallel)
DCI also provides on-chip termination for SSTL3, SSTL2,
HSTL (Class I, II, III, or IV), and GTL/GTLP receivers or
transmitters on bidirectional lines.
Table 7
able in Virtex-II devices. V
Table
and GTLP_DCI, due to the on-chip termination resistor.
Table 7: SelectI/O-Ultra Buffers With On-Chip Parallel
Termination
Notes:
1. SSTL-compatible
SSTL3 Class II
SSTL2 Class II
HSTL Class IV
HSTL Class III
SSTL3 Class I
SSTL2 Class I
Virtex-II DCI
HSTL Class II
I/O Standard
HSTL Class I
Description
V
3.3 V
2.5 V
1.8 V
1.5 V
3. Note that there is a V
Z
Virtex-II Platform FPGAs: Functional Description
CCO
and
GTLP
GTL
Figure 10: Internal Series Termination
Table 8
IOB
V
CCO
list the on-chip parallel terminations avail-
LVDCI_33
LVDCI_25
LVDCI_18
LVDCI_15
= 3.3 V, 2.5 V, 1.8 V or 1.5 V
DCI
Termination
SSTL3_II
SSTL2_II
HSTL_IV
External
SSTL3_I
SSTL2_I
HSTL_III
HSTL_II
HSTL_I
GTLP
CCO
GTL
IOSTANDARD Attribute
CCO
Z
must be set according to
requirement for GTL_DCI
DCI Half Impedance
LVDCI_DV2_33
LVDCI_DV2_25
LVDCI_DV2_18
LVDCI_DV2_15
SSTL3_II_DCI
SSTL2_II_DCI
SSTL3_I_DCI
SSTL2_I_DCI
0
HSTL_III_DCI
HSTL_IV_DCI
HSTL_II_DCI
Termination
HSTL_I_DCI
). Virtex-II input
GTLP_DCI
GTL_DCI
On-Chip
DS031_51_110600
Module 2 of 4
(1)
(1)
(1)
(1)
8
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