XC3S1600E-4FGG320I Xilinx Inc, XC3S1600E-4FGG320I Datasheet - Page 171

IC FPGA SPARTAN-3E 1600K 320FBGA

XC3S1600E-4FGG320I

Manufacturer Part Number
XC3S1600E-4FGG320I
Description
IC FPGA SPARTAN-3E 1600K 320FBGA
Manufacturer
Xilinx Inc
Series
Spartan™-3Er
Datasheet

Specifications of XC3S1600E-4FGG320I

Number Of Logic Elements/cells
33192
Number Of Labs/clbs
3688
Total Ram Bits
663552
Number Of I /o
250
Number Of Gates
1600000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
320-BGA
For Use With
HW-XA3S1600E-UNI-G - KIT DEVELOPMENT AUTOMOTIVE ECU
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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User I/Os by Bank
Table 132
distributed between the four I/O banks on the VQ100 pack-
age.
Table 132: User I/Os Per Bank for XC3S100E, XC3S250E, and XC3S500E in the VQ100 Package
Footprint Migration Differences
The production XC3S100E, XC3S250E, and XC3S500E
FPGAs have identical footprints in the VQ100 package.
Designs can migrate between the devices without further
consideration.
DS312-4 (v3.8) August 26, 2009
Product Specification
Notes:
1.
2.
Top
Right
Bottom
Left
TOTAL
Package
Edge
Some VREF and CLK pins are on INPUT pins.
The eight global clock pins in this bank have optional functionality during configuration and are counted in the DUAL column.
indicates how the 66 available user-I/O pins are
R
I/O Bank
0
1
2
3
Maximum
I/O
15
15
19
17
66
I/O
16
5
6
0
5
www.xilinx.com
INPUT
0
0
0
1
1
All Possible I/O Pins by Type
DUAL
18
21
1
0
2
VREF
1
1
1
1
4
(1)
Pinout Descriptions
CLK
0
24
8
8
8
(2)
(1)
171

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