XC4VLX60-11FFG1148C Xilinx Inc, XC4VLX60-11FFG1148C Datasheet - Page 2

• Manufacturer Part Number: XC4VLX60-11FFG1148C
• Description: IC FPGA VIRTEX-4 60K 1148-FBGA
• Manufacturer: Xilinx Inc
• Series: Virtex™-4r

Specifications of XC4VLX60-11FFG1148C

• Number Of Logic Elements/cells: 59904
• Number Of Labs/clbs: 6656
• Total Ram Bits: 2949120
• Number Of I /o: 640
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 1148-BBGA, FCBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of Gates: -
• Other names: 122-1495

Table 1: Absolute Maximum Ratings (Continued)
Table 2: Recommended Operating Conditions
DS302 (v3.7) September 9, 2009
Product Specification
Notes:
1.
2.
3.
4.
AVCCAUXMGT
V
AVCCAUXRX
AVCCAUXTX
CCO
Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied. Exposure to
Absolute Maximum Ratings conditions for extended periods of time might affect device reliability.
For soldering guidelines and thermal considerations, see the
When using more than 100 3.3V I/Os, refer to the
For more flexibility in specific designs, a maximum of 100 user I/Os can be stressed beyond the normal spec for no more than 20% of a data period.
There are no bank restrictions.
Symbol
V
Symbol
V
V
BATT
CCAUX
CCINT
V
T
T
V
V
V
I
(1,3,4,5)
IN
STG
SOL
T
TRX
TTX
IN
TS
J
(2)
Internal supply voltage relative to GND, T
Internal supply voltage relative to GND, T
Auxiliary supply voltage relative to GND, T
Auxiliary supply voltage relative to GND, T
Supply voltage relative to GND, T
Supply voltage relative to GND, T
3.3V supply voltage relative to GND, T
3.3V supply voltage relative to GND, T
2.5V and below supply voltage relative to GND,
T
2.5V and below supply voltage relative to GND,
T
Maximum current through any pin in a powered or unpowered
bank when forward biasing the clamp diode.
Battery voltage relative to GND, T
Battery voltage relative to GND, T
J
J
Voltage applied to 3-state 3.3V output
(all user and dedicated I/Os)
Voltage applied to 3-state 3.3V output
(restricted to maximum of 100 user I/Os)
2.5V or below I/O input voltage relative to GND
(user and dedicated I/Os)
Receive auxiliary supply voltage relative to analog ground, GNDA
(RocketIO pins)
Transmit auxiliary supply voltage relative to analog ground, GNDA
(RocketIO pins)
Management auxiliary supply voltage relative to analog ground, GNDA
(RocketIO pins)
Terminal receive supply voltage relative to GND
Terminal transmit supply voltage relative to GND
Storage temperature (ambient)
Maximum soldering temperature
Maximum junction temperature
= 0° C to +85° C
= –40° C to +100° C
Description
Virtex-4 FPGA User
Description
(2)
J
J
J
J
(2)
= 0° C to +85° C
= –40° C to +100° C
= 0° C to +85° C
= –40° C to +100° C
J
J
Virtex-4 Packaging and Pinout Specification
= 0° C to +85° C
= –40° C to +100° C
www.xilinx.com
J
J
J
J
(3,4)
= 0° C to +85° C
= –40° C to +100° C
= –40° C to +100° C
Virtex-4 FPGA Data Sheet: DC and Switching Characteristics
= 0° C to +85° C
Guide, Chapter 6, “3.3V I/O Design Guidelines.”
Commercial
Commercial
Commercial
Commercial
Commercial
Commercial
Commercial
Industrial
Industrial
Industrial
Industrial
Industrial
Industrial
Industrial
on the Xilinx website.
GND – 0.20
GND – 0.20
GND – 0.20
GND – 0.20
(Commercial Temperature)
(Industrial Temperature)
2.375
2.375
Min
1.14
1.14
1.14
1.14
–0.75 to V
1.0
1.0
–0.75 to 4.05
–0.85 to 4.3
–0.5 to 1.32
–0.5 to 1.32
–0.5 to 1.65
–0.95 to 4.4
–0.5 to 3.0
–0.5 to 3.0
–65 to 150
+220
+125
CCO
V
V
CCO
CCO
2.625
2.625
Max
1.26
1.26
3.45
3.45
3.45
3.45
3.6
3.6
+0.5
10
10
+ 0.2
+ 0.2
Units
Units
mA
mA
° C
° C
° C
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
2