XC5VLX110-2FFG1153I Xilinx Inc, XC5VLX110-2FFG1153I Datasheet - Page 189
XC5VLX110-2FFG1153I
Manufacturer Part Number
XC5VLX110-2FFG1153I
Description
IC FPGA VIRTEX-5 110K 1153FBGA
Manufacturer
Xilinx Inc
Series
Virtex™-5 LXr
Datasheets
1.XC5VLX30-1FFG324C.pdf
(91 pages)
2.XC5VLX30-1FFG324C.pdf
(13 pages)
3.XC5VLX30-1FFG324C.pdf
(385 pages)
Specifications of XC5VLX110-2FFG1153I
Number Of Logic Elements/cells
110592
Number Of Labs/clbs
8640
Total Ram Bits
4718592
Number Of I /o
800
Voltage - Supply
0.95 V ~ 1.05 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
1153-BBGA, FCBGA
For Use With
HW-V5-ML523-UNI-G - EVALUATION PLATFORM VIRTEX-5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XC5VLX110-2FFG1153I
Manufacturer:
XILINX
Quantity:
6
Company:
Part Number:
XC5VLX110-2FFG1153I
Manufacturer:
Xilinx Inc
Quantity:
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Virtex-5 FPGA User Guide
UG190 (v5.3) May 17, 2010
X-Ref Target - Figure 5-14
Distributed RAM configurations greater than the provided examples require more than
one SLICEM. There are no direct connections between slices to form larger distributed
RAM configurations within a CLB or between slices.
WCLK
A[7:0]
WE
D
(WE/CE)
Figure 5-14: Distributed RAM (RAM256X1S)
(CLK)
www.xilinx.com
6
8
6
8
6
8
6
8
DI1
A[6:1]
WA[8:1]
CLK
WE
DI1
A[6:1]
WA[8:1]
CLK
WE
DI1
A[6:1]
WA[8:1]
CLK
WE
DI1
A[6:1]
WA[8:1]
CLK
WE
RAM256X1S
SPRAM64
SPRAM64
SPRAM64
SPRAM64
O6
O6
O6
O6
F7BMUX
F7AMUX
A6 (AX)
A6 (CX)
F8MUX
A7 (BX)
O
D Q
CLB Overview
(Optional)
UG190_5_14_050506
Output
Registered
Output
189
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