AT40K05LV-3BQC Atmel, AT40K05LV-3BQC Datasheet - Page 59
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AT40K05LV-3BQC
Manufacturer Part Number
AT40K05LV-3BQC
Description
IC FPGA 3.3V 256 CELL 144-TQFP
Manufacturer
Atmel
Series
AT40K/KLVr
Datasheet
1.AT40K05-2BQC.pdf
(67 pages)
Specifications of AT40K05LV-3BQC
Number Of Logic Elements/cells
256
Total Ram Bits
2048
Number Of I /o
114
Number Of Gates
10000
Voltage - Supply
3 V ~ 3.6 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 70°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Number Of Labs/clbs
-
100T1 – TQFP
0896C–FPGA–04/02
Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,
2. The top package body size may be smaller than the bottom package size by as much as 0.15 mm.
3. Dimensions D1 and E1 do not include mold protrusions. Allowable protrusion is 0.25 mm per side. D1 and E1 are maximum plastic
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall not cause the lead width to exceed the maximum
5. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm from the lead tip.
6. A1 is defined as the distance from the seating place to the lowest point on the package body.
e
datums, etc.
body size dimensions, including mold mismatch.
b dimension by more than 0.08 mm. Dambar cannot be located on the lower radius or the foot. Minimum space between protrusion and
an adjacent lead is 0.07 mm for 0.4 and 0.5 mm pitch packages.
R
A1
2325 Orchard Parkway
San Jose, CA 95131
b
A2
Top View
Side View
L1
D1
TITLE
100T1, 100-lead (14 x 14 x 1.0 mm Body), Thin Plastic
Quad Flat Pack (TQFP)
E1
AT40K/AT40KLV Series FPGA
SYMBOL
XX
A1
A2
D
D1
E
E1
e
b
L1
Bottom View
0.05
0.95
0.17
COMMON DIMENSIONS
MIN
(Unit of Measure = mm)
D
16.00 BSC
14.00 BSC
16.00 BSC
14.00 BSC
0.50 BSC
1.00 REF
NOM
1.00
0.22
N
DRAWING NO.
0.15
1.05
0.27
100T1
MAX
NOTE
E
6
2, 3
2, 3
4, 5
11/30/01
REV.
A
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