AT40K20LV-3BGC Atmel, AT40K20LV-3BGC Datasheet - Page 61
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AT40K20LV-3BGC
Manufacturer Part Number
AT40K20LV-3BGC
Description
IC FPGA 3.3V 1024 CELL 352-BGA
Manufacturer
Atmel
Series
AT40K/KLVr
Datasheet
1.AT40K05-2BQC.pdf
(67 pages)
Specifications of AT40K20LV-3BGC
Number Of Logic Elements/cells
1024
Total Ram Bits
8192
Number Of I /o
289
Number Of Gates
30000
Voltage - Supply
3 V ~ 3.6 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 70°C
Package / Case
352-LBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Number Of Labs/clbs
-
Other names
AT40K20LV3BGC
144L1 – LQFP
0896C–FPGA–04/02
Notes:
A1
e
1. This drawing is for general information only; refer to JEDEC Drawing MS-026 for additional information.
2. The top package body size may be smaller than the bottom package size by as much as 0.15 mm.
3. Dimensions D1 and E1 do not include mold protrusions. Allowable protrusion is 0.25 mm per side. D1 and E1 are maximum plastic
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall not cause the lead width to exceed the maximum
5. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm from the lead tip.
6. A1 is defined as the distance from the seating place to the lowest point on the package body.
R
body size dimensions including mold mismatch.
b dimension by more than 0.08 mm. Dambar cannot be located on the lower radius or the foot. Minimum space between protrusion and
an adjacent lead is 0.07 mm for 0.4 and 0.5 mm pitch packages.
2325 Orchard Parkway
San Jose, CA 95131
A2
b
L1
Side View
Top View
D1
TITLE
144L1, 144-lead (20 x 20 x 1.4 mm Body), Low Profile
Plastic Quad Flat Pack (LQFP)
E1
AT40K/AT40KLV Series FPGA
SYMBOL
XX
A1
A2
D
D1
E
E1
e
b
L1
Bottom View
COMMON DIMENSIONS
0.05
1.35
0.17
MIN
(Unit of Measure = mm)
D
22.00 BSC
20.00 BSC
22.00 BSC
20.00 BSC
0.50 BSC
1.00 REF
NOM
1.40
0.22
DRAWING NO.
N
144L1
MAX
0.15
1.45
0.27
NOTE
2, 3
2, 3
11/30/01
6
4, 5
E
REV.
A
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