MPC852TCVR66A Freescale Semiconductor, MPC852TCVR66A Datasheet - Page 75
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MPC852TCVR66A
Manufacturer Part Number
MPC852TCVR66A
Description
IC MPU POWERQUICC 66MHZ 256PBGA
Manufacturer
Freescale Semiconductor
Datasheet
1.MPC852TVR50A.pdf
(80 pages)
Specifications of MPC852TCVR66A
Processor Type
MPC8xx PowerQUICC 32-Bit
Speed
66MHz
Voltage
1.8V
Mounting Type
Surface Mount
Package / Case
256-PBGA
Processor Series
MPC8xx
Core
MPC8xx
Data Bus Width
32 bit
Development Tools By Supplier
MPC852TADS-KIT
Maximum Clock Frequency
66 MHz
Operating Supply Voltage
1.8 V, 3.3 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Family Name
MPC8xx
Device Core
PowerQUICC
Device Core Size
32b
Frequency (max)
66MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
1.8/3.3V
Operating Supply Voltage (max)
1.9/3.465V
Operating Supply Voltage (min)
1.7/3.135V
Operating Temp Range
-40C to 100C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
256
Package Type
BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC852TCVR66A
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
16.2
For more information on the printed-circuit board layout of the PBGA package, including thermal via
design and suggested pad layout, refer to Plastic Ball Grid Array Application Note (order number:
AN1231) that is available from your local Freescale sales office.
dimensions of the PBGA package.
Freescale Semiconductor
Figure 65. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package
Mechanical Dimensions of the PBGA Package
Notes:
Note: Solder sphere composition is 95.5%Sn 45%Ag 0.5%Cu for MPC852TVRXXX.
1. All dimensions are in millimeters.
2. Interpret dimensions and tolerances per ASME Y14.5M—1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is defined by the spherical crowns of the solder balls.
Solder sphere composition is 62%Sn 36%Pb 2%Ag for MPC852TZTXXX.
MPC852T PowerQUICC™ Hardware Specifications, Rev. 4
Figure 65
Mechanical Data and Ordering Information
shows the mechanical
75