MPC885CVR133 Freescale Semiconductor, MPC885CVR133 Datasheet - Page 10

• Manufacturer Part Number: MPC885CVR133
• Description: IC MPU POWERQUICC 133MHZ 357PBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC885CVR133

• Processor Type: MPC8xx PowerQUICC 32-Bit
• Speed: 133MHz
• Voltage: 3.3V
• Mounting Type: Surface Mount
• Package / Case: 357-PBGA
• Processor Series: MPC8xx
• Core: MPC8xx
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 133 MHz
• Operating Supply Voltage: 0 V to 5 V
• Maximum Operating Temperature: + 95 C
• Mounting Style: SMD/SMT
• Data Ram Size: 8 KB
• I/o Voltage: 5 V
• Interface Type: I2C, SPI, UART
• Minimum Operating Temperature: 0 C
• Program Memory Size: 8 KB
• Program Memory Type: EPROM/Flash
• For Use With: CWH-PPC-885XN-VX - BOARD EVAL QUICCSTART MPC885CWH-PPC-885XN-VE - BOARD EVAL QUICCSTART MPC885
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Thermal Characteristics
This device contains circuitry protecting against damage due to high-static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (for example, either GND or V
4
Table 4
1
2
3
4
5
6
10
Junction-to-ambient
Junction-to-board
Junction-to-case
Junction-to-package top
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed pad packages
where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated value from the junction to
the exposed pad without contact resistance.
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
Thermal Characteristics
shows the thermal characteristics for the MPC885/MPC880.
Rating
1
5
4
Temperature
Temperature (extended)
Minimum temperatures are guaranteed as ambient temperature, T
temperatures are guaranteed as junction temperature, T
1
6
MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7
1
(standard)
Table 4. MPC885/MPC880 Thermal Resistance Data
Natural convection
Airflow (200 ft/min)
Natural convection
Airflow (200 ft/min)
Rating
Table 3. Operating Temperatures
—
—
Environment
Single-layer board (1s)
Four-layer board (2s2p)
Single-layer board (1s)
Four-layer board (2s2p)
Symbol
T
T
T
T
A(min)
J(max)
A(min)
J(max)
J
—
—
—
—
.
A
. Maximum
Value
–40
100
95
0
Symbol
R
R
R
R
R
R
θJMA
θJMA
θJMA
Ψ
Ψ
θJA
θJC
θJB
JT
JT
DD
2
3
3
3
Freescale Semiconductor
Unit
°C
°C
°C
°C
).
Value
37
25
30
22
17
10
2
2
°C/W
Unit