MPC8250ACZUMHBC Freescale Semiconductor, MPC8250ACZUMHBC Datasheet
MPC8250ACZUMHBC
Specifications of MPC8250ACZUMHBC
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MPC8250ACZUMHBC Summary of contents
Page 1
... PBGA version unless otherwise specified. This document contains information on a new product. Specifications and information herein are subject to change without notice. © Freescale Semiconductor, Inc., 2003, 2005, 2009. All rights reserved. Document Number: MPC8250EC 1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2. Electrical and Thermal Characteristics . . . . . . . . . . . . 6 3 ...
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... Figure 1. MPC8250 Block Diagram MPC8250 Hardware Specifications, Rev. 2 System Interface Unit (SIU) 60x Bus Bus Interface Unit PCI Bus 32 bits MHz 60x-to-PCI Bridge or 60x-to-Local Local Bus Bridge 32 bits MHz Memory Controller Clock Counter System Functions 2 SMC2 SPI I C Non-Multiplexed I/O Freescale Semiconductor ...
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... Three user programmable machines, general-purpose chip-select machine, and page-mode pipeline SDRAM machine — Byte selects for 64 bus width (60x) and byte selects for 32 bus width (local) Freescale Semiconductor MPC8250 Hardware Specifications, Rev. 2 Features 3 ...
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... One serial peripheral interface identical to the MPC860 SPI — One inter-integrated circuit (I – Microwire compatible – Multiple-master, single-master, and slave modes — four TDM interfaces – Supports one group of four TDM channels controller (identical to the MPC860 I MPC8250 Hardware Specifications, Rev controller) Freescale Semiconductor ...
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... August 3, 1998) — Support for 66 MHz, 3.3 V specification — 60x-PCI bus core logic which uses a buffer pool to allocate buffers for each port — Makes use of the local bus signals, so there is no need for additional pins Freescale Semiconductor l capabilities MPC8250 Hardware Specifications, Rev. 2 ...
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... Value Unit -0.3 – 2.5 V -0.3 – 2.5 V -0.3 – 4.0 V GND(-0.3) – 3.6 V 120 °C (-55) – (+150) °C Table 2) at the maximums is not 1 Value Unit 3 4 1.9 –2 1.9–2 105 °C 5 0–70 °C Freescale Semiconductor ...
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... Input leakage current VDDH IN Hi-Z (off state) leakage current, V Signal low input current 0 Signal high input current 2 Output high voltage – Freescale Semiconductor NOTE: Core, PLL, and I/O Supply Voltages GND Not to exceed 10 SDRAM_CLK Figure 2. Overshoot/Undershoot Voltage Table 3. DC Electrical Characteristics Symbol ...
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... DP(4)/IRQ4/EXT_BG3/CORE_SREST DP(5)/TBEN/IRQ5/EXT_DBG3 DP(6)/CSE(0)/IRQ6 DP(7)/CSE(1)/IRQ7 PSDVAL TA TEA GBL/IRQ1 CI/BADDR29/IRQ2 WT/BADDR30/IRQ3 L2_HIT/IRQ4 CPU_BG/BADDR31/IRQ5 CPU_DBG CPU_BR IRQ0/NMI_OUT IRQ7/INT_OUT/APE PORESET HRESET SRESET RSTCONF QREQ 8 1 Symbol V OL MPC8250 Hardware Specifications, Rev. 2 (continued) Min Max Unit — 0.4 V Freescale Semiconductor ...
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... L_A21/PERR L_A22/SERR L_A23/REQ0 L_A24/REQ1/HSEJSW L_A25/GNT0 L_A26/GNT1/HSLED L_A27/GNT2/HSENUM L_A28/RST/CORE_SRESET L_A29/INTA L_A30/REQ2 L_A31 LCL_D(0-31)/AD(0-31) LCL_DP(0-3)/C/BE(0-3) PA[0–31] PB[4–31] PC[0–31] PD[4–31] TDO Freescale Semiconductor 1 Symbol V OL MPC8250 Hardware Specifications, Rev. 2 Electrical and Thermal Characteristics (continued) Min Max Unit — 0 ...
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... JB θ 1 °C can be obtained from the following °C/W junction to ambient , , . neglected an approximate relationship between P , INT I/O θ MPC8250 Hardware Specifications, Rev. 2 Unit Air Flow Natural convection 1 m/s °C/W Natural convection 1 m/s °C/W — °C/W — (1) and D (2) (3) Freescale Semiconductor ...
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... Test temperature = room temperature ( Watts INT DD DD Freescale Semiconductor . Using this value of K the values power supply should be bypassed to ground using at least four CC and ground should be kept to less than half an CC and GND circuits. Pull up all unused inputs or signals that will (when the ambient temperature is 70° ...
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... FCC inputs—external clock (NMSI) 12 Table 6. Table 6. Output Buffer Impedances Typical Impedance (Ω) Characteristic Characteristic MPC8250 Hardware Specifications, Rev Max Delay (ns) Min Delay (ns) 66 MHz 83 MHz 66 MHz 83 MHz 6 5 0.5 1 Setup (ns) Hold (ns) 66 MHz 83 MHz 66 MHz 83 MHz 2.5 3 Freescale Semiconductor 0.5 1 0.5 0 ...
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... FCC external clock. Serial ClKin sp16b FCC input signals FCC output signals Note: When GFMR[TCI FCC output signals Note: When GFMR[TCI Freescale Semiconductor Characteristic sp17b sp36b/sp37b Figure 3. FCC External Clock Diagram MPC8250 Hardware Specifications, Rev. 2 Electrical and Thermal Characteristics 1 ...
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... Input sampled on the falling edge and output driven on the falling edge. 4. Input sampled on the falling edge and output driven on the rising edge. Figure 5. SCC/SMC/SPI/I 14 sp17a sp36a/sp37a Figure 4. FCC Internal Clock Diagram 2 C external clock. sp18b sp38b/sp39b 2 C External Clock Diagram MPC8250 Hardware Specifications, Rev. 2 sp36a/sp37a sp19b Freescale Semiconductor ...
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... Input sampled on the rising edge and output driven on the rising edge (shown). 2. Input sampled on the rising edge and output driven on the falling edge. 3. Input sampled on the falling edge and output driven on the falling edge. 4. Input sampled on the falling edge and output driven on the rising edge. Freescale Semiconductor 2 C internal clock. sp18a ...
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... Sys clk sp22 (See note) (See note) output signals Table 9. AC Characteristics for SIU Inputs Characteristic MPC8250 Hardware Specifications, Rev. 2 sp23 sp23 sp22 sp42/sp43 sp42/sp43 sp42a/sp43a 1 Setup (ns) Hold (ns) 66 MHz 83 MHz 66 MHz 83 MHz 6 5 0.5 0 0.5 0 0.5 0 0.5 0 0.5 0.5 Freescale Semiconductor ...
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... Activating data pipelining (setting BRx[DR] in the memory controller) improves the AC timing. When data pipelining is activated, sp12 can be used for data bus setup even when ECC or PARITY are used. Also, sp33a can be used as the AC specification for DP signals. Freescale Semiconductor Characteristic NOTE MPC8250 Hardware Specifications, Rev. 2 ...
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... DATA bus, ECC, and PARITY mode input signals 18 sp11 sp12 sp15 sp31 sp32 sp33a sp35 Figure 9. Bus Signals CLKin sp13 sp14 DP mode input signal DP mode output signal Figure 10. Parity Mode Diagram MPC8250 Hardware Specifications, Rev. 2 sp10 sp10 sp10 sp30 sp30 sp30 sp30 sp10 sp10 sp33b/sp30 Freescale Semiconductor ...
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... Figure graphical representation of CLKin T1 CLKin T1 CLKin T1 Figure 12. Internal Tick Spacing for Memory Controller Signals Freescale Semiconductor sp34/sp30 Figure 11. MEMC Mode Diagram NOTE Tick Spacing (T1 Occurs at the Rising Edge of CLKin 1/4 CLKin 1/2 CLKin 3/10 CLKin 1/2 CLKin 4/14 CLKin ...
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... MPC8250 Hardware Specifications, Rev. 2 Table 12. PCI Clock Frequency Range Reference (MHZ) — Table 13 and Table 14 50–66 Table 15 and Table 16 25–50 50–66 Table 17 and Table 18 25–50 Core Multiplication Core Factor Frequency 4 133 MHz 5 166 MHz 4 133 MHz 5 166 MHz Freescale Semiconductor ...
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... MHz 0010_101 33 MHz 0010_110 33 MHz 0010_111 33 MHz 0011_000 33 MHz 0011_001 33 MHz 0011_010 33 MHz 0011_011 33 MHz Freescale Semiconductor Table 13. Clock Default Configurations CPM Multiplication CPM Factor Frequency 2 133 MHz 2 133 MHz 2.5 166 MHz 2.5 166 MHz Table 14. Clock Configuration Modes CPM Multiplication ...
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... MHz 5 166 MHz 6 200 MHz 7 233 MHz 8 266 MHz 2 133 MHz 2.5 166 MHz 3 200 MHz 3.5 233 MHz 4 266 MHz 4.5 300 MHz 2 133 MHz 2.5 166 MHz 3 200 MHz 3.5 233 MHz 4 266 MHz 4.5 300 MHz Freescale Semiconductor 2 ...
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... MODCK_H[0–3] comes from {LGPL0, LGPL1, LGPL2, LGPL3}. The minimum Tval = 2 when PCI_MODCK = 1, and the minimum Tval = 1 when PCI_MODCK = 0. Therefore, designers should use clock configurations that fit this condition to achieve PCI-compliant AC timing. Clock configurations change only after POR is asserted. Freescale Semiconductor 1 CPM Multiplication CPM 2, 3 ...
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... MHz 233 MHz 3/6 33/16 MHz 266 MHz 3/6 33/16 MHz 166 MHz 4/8 33/16 MHz 200 MHz 4/8 33/16 MHz 233 MHz 4/8 33/16 MHz 266 MHz 4/8 33/16 MHz 166 MHz 5 33 MHz 200 MHz 5 33 MHz Freescale Semiconductor 2 2 ...
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... MHz 0111_001 66 MHz 0111_010 66 MHz 0111_011 66 MHz 0111_100 66 MHz 1000_000 66 MHz 1000_001 66 MHz 1000_010 66 MHz 1000_011 66 MHz 1000_100 66 MHz 1001_000 66 MHz Freescale Semiconductor CPM Core CPM Multiplication Frequency Factor Factor 5 166 MHz 7 5 166 MHz 8 6 200 MHz 5 6 200 MHz 6 6 ...
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... MHz 4/8 62/31 MHz 350 MHz 4/8 62/31 MHz 400 MHz 4/8 62/31 MHz Core Bus Division 60x Bus 3 Frequency Factor Frequency 166 MHz 2 66 MHz 200 MHz 2 66 MHz 200 MHz 3 66 MHz 266 MHz 3 66 MHz Freescale Semiconductor 2 4 ...
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... MHz 0011_001 66/33 MHz 0011_010 66/33 MHz 0011_011 66/33 MHz 0011_100 66/33 MHz 0100_000 66/33 MHz 0100_001 66/33 MHz 0100_010 66/33 MHz Freescale Semiconductor CPM Core CPM Multiplication Frequency 2 Factor Factor 3/6 200 MHz 3 3/6 200 MHz 3.5 4/8 266 MHz 3 ...
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... MHz 2.5 80 MHz 240 MHz 2.5 80 MHz 280 MHz 2.5 80 MHz 320 MHz 2.5 80 MHz 360 MHz 2.5 80 MHz 166 MHz 4 66 MHz 200 MHz 4 66 MHz 233 MHz 4 66 MHz 266 MHz 4 66 MHz 300 MHz 4 66 MHz Freescale Semiconductor 4 ...
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... This section provides the pin assignments and pinout list for the MPC8250. 4.1 TBGA Package The following figures and table represent the standard 480 TBGA package. For information on the alternate package, refer to Section 4.2, “PBGA Package.” Freescale Semiconductor CPM Core CPM Multiplication Frequency ...
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... Pinout 4.1.1 TBGA Pin Assignments Figure 13 shows the pinout of the TBGA package as viewed from the top surface Not to Scale Figure 13. Pinout of the 480 TBGA Package as Viewed from the Top Surface MPC8250 Hardware Specifications, Rev Freescale Semiconductor ...
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... A10 A11 A12 Freescale Semiconductor View Die Attach Die Glob-Top Filled Area Glob-Top Dam Wire Bonds Figure 14. Side View of the TBGA Package Table 19. Symbol Legend Signals with overbars, such as TA, are active low. Indicates that a signal is part of the media independent interface. ...
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... A16 A17 A18 A19 A20 A21 A22 A23 A24 A25 A26 A27 A28 A29 A30 A31 TT0 TT1 TT2 TT3 TT4 TBST TSIZ0 TSIZ1 TSIZ2 TSIZ3 AACK ARTRY DBG DBB/IRQ3 Pin Name MPC8250 Hardware Specifications, Rev. 2 Ball B20 A18 Freescale Semiconductor ...
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... D16 D17 D18 D19 D20 D21 D22 D23 D24 D25 D26 D27 D28 D29 D30 D31 D32 D33 D34 D35 D36 Freescale Semiconductor Pin Name MPC8250 Hardware Specifications, Rev. 2 Pinout Ball A16 A13 E12 A20 E17 B15 B13 A11 D19 D17 ...
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... D63 DP0/RSRV/EXT_BR2 IRQ1/DP1/EXT_BG2 IRQ2/DP2/TLBISYNC/EXT_DBG2 IRQ3/DP3/CKSTP_OUT/EXT_BR3 IRQ4/DP4/CORE_SRESET/EXT_BG3 IRQ5/DP5/TBEN/EXT_DBG3 IRQ6/DP6/CSE0 IRQ7/DP7/CSE1 34 Pin Name MPC8250 Hardware Specifications, Rev. 2 Ball D18 A17 A14 B12 A10 C18 E16 B14 C12 B10 B18 B16 E14 D12 C10 B22 A22 E21 D21 C21 B21 A21 E20 Freescale Semiconductor ...
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... CS3 CS4 CS5 CS6 CS7 CS8 CS9 CS10/BCTL1 CS11/AP0 BADDR27 BADDR28 ALE BCTL0 PWE0/PSDDQM0/PBS0 PWE1/PSDDQM1/PBS1 PWE2/PSDDQM2/PBS2 PWE3/PSDDQM3/PBS3 PWE4/PSDDQM4/PBS4 PWE5/PSDDQM5/PBS5 PWE6/PSDDQM6/PBS6 PWE7/PSDDQM7/PBS7 PSDA10/PGPL0 Freescale Semiconductor Pin Name MPC8250 Hardware Specifications, Rev. 2 Pinout Ball V3 C22 F25 C29 E27 E28 F26 F27 F28 G25 ...
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... MPC8250 Hardware Specifications, Rev. 2 Ball B24 A24 B23 A23 D22 H28 H27 H26 G29 D27 C28 E26 D25 C26 B27 D28 N27 T29 R27 R26 R29 R28 W29 P28 N26 AA27 P29 AA26 N25 AA25 AB29 AB28 P25 AB27 H29 Freescale Semiconductor ...
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... LCL_D18/AD18 LCL_D19/AD19 LCL_D20/AD20 LCL_D21/AD21 LCL_D22/AD22 LCL_D23/AD23 LCL_D24/AD24 LCL_D25/AD25 LCL_D26/AD26 LCL_D27/AD27 LCL_D28/AD28 LCL_D29/AD29 LCL_D30/AD30 LCL_D31/AD31 LCL_DP0/C0/BE0 LCL_DP1/C1/BE1 LCL_DP2/C2/BE2 LCL_DP3/C3/BE3 Freescale Semiconductor Pin Name MPC8250 Hardware Specifications, Rev. 2 Pinout Ball J29 J28 J27 J26 J25 K25 L29 L27 L26 L25 M29 M28 M27 ...
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... PA16/FCC1_RXD1 38 Pin Name MPC8250 Hardware Specifications, Rev. 2 Ball T1 D1 AH3 AG5 AJ3 AE6 AF5 AB4 AG6 AH5 AF6 AA3 AJ4 AB2 AH4 1 AC29 1 AC25 1 AE28 1 AG29 1 AG28 1 AG26 1 AE24 1 AH25 1 AF23 1 AH23 1 AE22 1 AH22 1 AJ21 1 AH20 1 AG19 1 AF18 1 AF17 Freescale Semiconductor ...
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... PA30/FCC1_MII_CRS/FCC1_RTS PA31/FCC1_MII_COL PB4/FCC3_TXD3/L1RSYNCA2/FCC3_RTS PB5/FCC3_TXD2/L1TSYNCA2/L1GNTA2 PB6/FCC3_TXD1/L1RXDA2/L1RXD0A2 PB7/FCC3_TXD0/FCC3_TXD/L1TXDA2/L1TXD0A2 PB8/FCC3_RXD0/FCC3_RXD/TXD3 PB9/FCC3_RXD1/L1TXD2A2 PB10/FCC3_RXD2 PB11/FCC3_RXD3 PB12/FCC3_MII_CRS/TXD2 PB13/FCC3_MII_COL/L1TXD1A2 PB14/FCC3_MII_TX_EN/RXD3 PB15/FCC3_MII_TX_ER/RXD2 PB16/FCC3_MII_RX_ER/CLK18 PB17/FCC3_MII_RX_DV/CLK17 PB18/FCC2_RXD3/L1CLKOD2/L1RXD2A2 PB19/FCC2_RXD2/L1RQD2/L1RXD3A2 PB20/FCC2_RXD1/L1RSYNCD2/L1TXD1A1 PB21/FCC2_RXD0/FCC2_RXD/L1TSYNCD2/L1GNTD2 PB22/FCC2_TXD0/FCC2_TXD/L1RXDD2 PB23/FCC2_TXD1/L1TXDD2 Freescale Semiconductor Pin Name MPC8250 Hardware Specifications, Rev. 2 Pinout Ball 1 AE16 1 AJ16 1 AG15 1 AJ13 1 AE13 1 AF12 1 AG11 1 AH9 1 AJ8 ...
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... MPC8250 Hardware Specifications, Rev. 2 Ball 1 AJ9 1 AE9 1 AJ7 1 AH6 1 AE3 1 AE2 1 AC5 1 AC4 1 AB26 1 AD29 1 AE29 1 AE27 1 AF27 1 AF24 1 AJ26 1 AJ25 1 AF22 1 AE21 1 AF20 1 AE19 1 AE18 1 AH18 1 AH17 1 AG16 1 AF15 1 AJ15 1 AH14 1 AG13 1 AH12 1 AJ11 1 AG10 1 AE10 1 AF9 1 AE8 1 AJ6 Freescale Semiconductor ...
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... PD12 PD13 PD14/L1CLKOC2/I2CSCL PD15/L1RQC2/I2CSDA PD16/SPIMISO PD17/BRGO2/SPIMOSI PD18/SPICLK PD19/SPISEL/BRGO PD20/RTS4/TENA4/L1RSYNCA2 PD21/TXD4/L1RXD0A2/L1RXDA2 PD22/RXD4/L1TXD0A2/L1TXDA2 PD23/RTS3/TENA3 PD24/TXD3 PD25/RXD3 PD26/RTS2/TENA2 PD27/TXD2 PD28/RXD2 PD29/RTS1/TENA1 PD30/TXD1 PD31/RXD1 VCCSYN VCCSYN1 Freescale Semiconductor Pin Name MPC8250 Hardware Specifications, Rev. 2 Pinout Ball 1 AG2 1 AF3 1 AF2 1 AE1 1 AD1 1 AC28 1 AD27 1 AF29 1 AF28 ...
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... AJ19, AH10, AJ10, AJ5 AA5, AF21, AF14, AF8, AE7, AF11, AE17, AE23, AC26, AB25, Y26, V25, T26, R25, P26, M25, K27, H25, G26, D7, D10, D14, D16, D20, D23, C9, E11, E13, E15, E19, E22, B3, G5, H4, K5, M3, P5, T4, Y5, AA2, AC3 Freescale Semiconductor ...
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... PBGA Pin Assignments Figure 15 shows the pinout of the PBGA package as viewed from the top surface Not to Scale Figure 15. Pinout of the 516 PBGA Package (View from Top) Freescale Semiconductor MPC8250 Hardware Specifications, Rev. 2 Pinout ...
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... Table 21. Symbol Legend Signals with overbars, such as TA, are active low. Indicates that a signal is part of the media independent interface. Pin Name MPC8250 Hardware Specifications, Rev. 2 Screen-printed solder mask Cu substrate traces BT resin glass epoxy Table 21 defines conventions and Meaning Ball C16 Freescale Semiconductor ...
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... A26 A27 A28 A29 A30 A31 TT0 TT1 TT2 TT3 TT4 TBST TSIZ0 TSIZ1 TSIZ2 TSIZ3 AACK ARTRY DBG DBB/IRQ3 Freescale Semiconductor Pin Name MPC8250 Hardware Specifications, Rev. 2 Pinout Ball F11 E11 A8 D11 B10 C11 A9 B11 C12 D12 A10 B12 B13 ...
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... D8 D9 D10 D11 D12 D13 D14 D15 D16 D17 D18 D19 D20 D21 D22 D23 D24 D25 D26 D27 D28 D29 D30 D31 D32 D33 D34 D35 D36 D37 46 Pin Name MPC8250 Hardware Specifications, Rev. 2 Ball AB1 AA2 AA1 Freescale Semiconductor ...
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... D42 D43 D44 D45 D46 D47 D48 D49 D50 D51 D52 D53 D54 D55 D56 D57 D58 D59 D60 D61 D62 D63 DP0/RSRV/EXT_BR2 IRQ1/DP1/EXT_BG2 IRQ2/DP2/TLBISYNC/EXT_DBG2 IRQ3/DP3/CKSTP_OUT/EXT_BR3 IRQ4/DP4/CORE_SRESET/EXT_BG3 IRQ5/DP5/TBEN/EXT_DBG3 IRQ6/DP6/CSE0 IRQ7/DP7/CSE1 PSDVAL Freescale Semiconductor Pin Name MPC8250 Hardware Specifications, Rev. 2 Pinout Ball ...
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... MPC8250 Hardware Specifications, Rev. 2 Ball Y4 D16 E15 D14 E14 A17 B14 F13 B17 AC6 AD6 AE6 AB7 AF7 AC7 AD7 AF8 AE8 AD8 AC8 AB8 C13 A12 D13 AF4 AA5 AE4 AD4 AF3 AB4 AE3 AF2 AD3 AE2 AD2 Freescale Semiconductor ...
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... L_A16/TRDY L_A17/IRDY/CKSTP_OUT L_A18/STOP L_A19/DEVSEL L_A20/IDSEL L_A21/PERR L_A22/SERR L_A23/REQ0 L_A24/REQ1/HSEJSW L_A25/GNT0 L_A26/GNT1/HSLED L_A27/GNT2/HSENUM L_A28/RST/CORE_SRESET L_A29/INTA L_A30/REQ2 L_A31/DLLOUT LCL_D0/AD0 LCL_D1/AD1 Freescale Semiconductor Pin Name MPC8250 Hardware Specifications, Rev. 2 Pinout Ball AE1 AC3 W6 AA4 AC9 AD9 AE9 AF9 AB6 AF5 AE5 AD5 AC5 AB5 ...
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... MPC8250 Hardware Specifications, Rev. 2 Ball AC10 AD10 AE10 AF10 AF11 AB12 AB11 AF12 AE11 AC13 AC12 AB13 AD12 AF14 AF17 AE16 AD16 AC16 AB16 AF18 AE17 AD17 AB17 AE18 AD18 AC18 AE19 AF20 AD19 AB18 AE12 AA13 AC15 AF19 A11 Freescale Semiconductor ...
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... PA0/RESTART1/DREQ3 PA1/REJECT1/DONE3 PA2/CLK20/DACK3 PA3/CLK19/DACK4/L1RXD1A2 PA4/REJECT2/DONE4 PA5/RESTART2/DREQ4 PA6 PA7/SMSYN2 PA8/SMRXD2 PA9/SMTXD2 PA10/MSNUM5 PA11/MSNUM4 PA12/MSNUM3 PA13/MSNUM2 PA14/FCC1_RXD3 PA15/FCC1_RXD2 PA16/FCC1_RXD1 PA17/FCC1_RXD0/FCC1_RXD Freescale Semiconductor Pin Name MPC8250 Hardware Specifications, Rev. 2 Pinout Ball E5 F22 A24 C24 A25 B24 C19 B25 D24 E23 D18 E24 B16 F16 ...
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... MPC8250 Hardware Specifications, Rev. 2 Ball 1 N26 1 N23 1 K26 1 L23 1 K23 1 H26 1 F25 1 D26 1 D25 1 C25 1 C22 1 B21 1 A20 1 A19 1 AD21 1 AD22 1 AC22 1 AE26 1 AB23 1 AC26 1 AB26 1 AA25 1 W26 1 W25 1 V24 1 U24 1 R22 1 R23 1 M23 1 L24 1 K24 1 L21 1 P25 1 N25 1 E26 Freescale Semiconductor ...
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... PC7/FCC1_CTS PC8/CD4/RENA4/SI2_L1ST2/CTS3 PC9/CTS4/CLSN4/SI2_L1ST1/ L1TSYNCA2/L1GNTA2 PC10/CD3/RENA3 PC11/CTS3/CLSN3/L1TXD3A2 PC12/CD2/RENA2 PC13/CTS2/CLSN2 PC14/CD1/RENA1 PC15/CTS1/CLSN1/SMTXD2 PC16/CLK16/TIN4 PC17/CLK15/TIN3/BRGO8 PC18/CLK14/TGATE2 PC19/CLK13/BRGO7/SPICLK PC20/CLK12/TGATE1 PC21/CLK11/BRGO6 PC22/CLK10/DONE1 PC23/CLK9/BRGO5/DACK1 PC24/CLK8/TOUT4 PC25/CLK7/BRGO4 PC26/CLK6/TOUT3/TMCLK PC27/FCC3_TXD/FCC3_TXD0/CLK5/ BRGO3 Freescale Semiconductor Pin Name MPC8250 Hardware Specifications, Rev. 2 Pinout Ball 1 H23 1 C26 1 B26 1 A22 1 A21 1 E20 1 C20 1 AE22 ...
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... MPC8250 Hardware Specifications, Rev. 2 Ball 1 E22 1 E21 1 D21 1 B20 1 AF23 1 AE23 1 AB21 1 AD23 1 AD26 1 Y22 1 AB24 1 Y23 1 AA26 1 W24 1 V22 1 U26 1 T23 1 R25 1 P23 1 N22 1 M25 1 L25 1 J26 1 K22 1 G25 1 H24 1 F24 1 H22 1 B22 1 D22 1 C21 1 E19 D19 K6 B18 Freescale Semiconductor ...
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... If PCI is not desired, must be pulled up or left floating. 4 For information on how to use this pin, refer to MPC8260 PowerQUICC II Thermal Resistor Guide (AN2271/D). 5 Package Description The following sections provide the package parameters and mechanical dimensions. Freescale Semiconductor Pin Name MPC8250 Hardware Specifications, Rev. 2 Package Description Ball K21 ...
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... Mechanical Dimensions This section discusses the TBGA and PBGA package dimensions. 56 Table 23. Table 23. Package Parameters Outline Type Interconnects (mm) TBGA 480 TBGA (Pb free) 27 × 27 PBGA 516 PBGA (Pb free) MPC8250 Hardware Specifications, Rev. 2 Pitch Nominal Unmounted (mm) Height (mm) 1.27 1.55 1 2.25 Freescale Semiconductor ...
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... TBGA Package Dimensions Figure 17 provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA package. Figure 17. Mechanical Dimensions and Bottom Surface Nomenclature—480 TBGA Freescale Semiconductor MPC8250 Hardware Specifications, Rev. 2 Package Description Notes: 1. Dimensions and Tolerancing per ASME Y14.5M-1994. ...
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... Package Description 5.2.2 PBGA Package Dimensions Figure 18 provides the mechanical dimensions and bottom surface nomenclature of the 516 PBGA package. Figure 18. Mechanical Dimensions and Bottom Surface Nomenclature—516 PBGA 58 MPC8250 Hardware Specifications, Rev. 2 Freescale Semiconductor ...
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... Table 22, “VR Pinout”: Addition of C18 to the Ground (GND) pin list (page 53) 0.7 10/2002 Table 22, “VR Pinout”: Addition the Core (VDDx) pin list (page 53) Freescale Semiconductor ZU XXX Figure 19. Freescale Part Number Key Table 24. Document Revision History Substantive Changes Figure 2 Table 3 . Addition of θ ...
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... Note 2 for Table 4 (changes in italics): “...greater than or equal to 266 MHz, 200 MHz CPM...” • Table 18: core and bus frequency values for the following ranges of MODCK_HMODCK: 0011_000 to 0011_100 and 1011_000 to 1011_1000 • Table 20: footnotes added to pins at AE11, AF25, U5, and V4. 0 11/2001 Initial version 60 Substantive Changes MPC8250 Hardware Specifications, Rev. 2 Freescale Semiconductor ...
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... THIS PAGE INTENTIONALLY LEFT BLANK Freescale Semiconductor MPC8250 Hardware Specifications, Rev. 2 Document Revision History 61 ...
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... Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer ...