MPC8541EVTAPF Freescale Semiconductor, MPC8541EVTAPF Datasheet - Page 64

IC MPU POWERQUICC III 783-FCPBGA

MPC8541EVTAPF

Manufacturer Part Number
MPC8541EVTAPF
Description
IC MPU POWERQUICC III 783-FCPBGA
Manufacturer
Freescale Semiconductor
Series
PowerQUICC IIIr
Datasheets

Specifications of MPC8541EVTAPF

Processor Type
MPC85xx PowerQUICC III 32-Bit
Speed
833MHz
Voltage
1.2V
Mounting Type
Surface Mount
Package / Case
783-FCPBGA
Core Size
32 Bit
Program Memory Size
64KB
Cpu Speed
833MHz
Digital Ic Case Style
BGA
No. Of Pins
783
Supply Voltage Range
1.14V To 1.26V
Rohs Compliant
Yes
Family Name
MPC85XX
Device Core
PowerQUICC III
Device Core Size
32b
Frequency (max)
833MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
1.2V
Operating Supply Voltage (max)
1.26V
Operating Supply Voltage (min)
1.14V
Operating Temp Range
0C to 105C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
783
Package Type
FCBGA
For Use With
MPC8548CDS - DEV TOOLS CDS FOR 8548CWH-PPC-8540N-VE - KIT EVAL SYSTEM MPC8540
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Compliant

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Clocking
15 Clocking
This section describes the PLL configuration of the MPC8541E. Note that the platform clock is identical
to the CCB clock.
15.1
Table 44
specifications for the memory bus.
e500 core
processor
frequency
Notes:
1. Caution: The CCB to SYSCLK ratio and e500 core to CCB ratio settings must be chosen such that the resulting SYSCLK
2.)The minimum e500 core frequency is based on the minimum platform frequency of 200 MHz.
3. 1000 MHz frequency supports only a 1.3 V core.
64
Characteristic
frequency, e500 (core) frequency, and CCB frequency do not exceed their respective maximum or minimum operating
frequencies. Refer to
MPC8541E PowerQUICC™ III Integrated Communications Processor Hardware Specification, Rev. 4.2
provides the clocking specifications for the processor core and
Clock Ranges
Memory bus frequency
Notes:
1. Caution: The CCB to SYSCLK ratio and e500 core to CCB ratio settings must be chosen such that
2. The memory bus speed is half of the DDR data rate, hence, half of the platform clock frequency.
3. 1000 MHz frequency supports only a 1.3 V core.
the resulting SYSCLK frequency, e500 (core) frequency, and CCB frequency do not exceed their
respective maximum or minimum operating frequencies. Refer to
Ratio,” and
Min
400
533 MHz
Section 15.2, “Platform/System PLL
Characteristic
Section 15.3, “e500 Core PLL
Max
533
Table 44. Processor Core Clocking Specifications
Table 45. Memory Bus Clocking Specifications
Min
400
600 MHz
Maximum Processor Core Frequency
Max
600
Ratio,” for ratio settings.
Min
400
533, 600, 667, 883, 1000 MHz
Maximum Processor Core
667 MHz
Ratio,” and
Min
100
Max
667
Frequency
Section 15.3, “e500 Core PLL
Min
400
833 MHz
Section 15.2, “Platform/System PLL
Max
166
Max
833
Table 44
Unit
MHz
Min
400
1000 MHz
provides the clocking
Freescale Semiconductor
Ratio,” for ratio settings.
1000
Max
Notes
1, 2, 3
MHz 1, 2, 3
Unit Notes

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