MPC8241LVR166D Freescale Semiconductor, MPC8241LVR166D Datasheet - Page 31
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MPC8241LVR166D
Manufacturer Part Number
MPC8241LVR166D
Description
IC MPU 32BIT 166MHZ PPC 357-PBGA
Manufacturer
Freescale Semiconductor
Datasheet
1.MPC8241LZQ200D.pdf
(58 pages)
Specifications of MPC8241LVR166D
Processor Type
MPC82xx PowerQUICC II 32-bit
Speed
166MHz
Voltage
1.8V
Mounting Type
Surface Mount
Package / Case
357-PBGA
Processor Series
MPC8xxx
Core
603e
Maximum Clock Frequency
166 MHz
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
0 C
Lead Free Status / RoHS Status
Request inventory verification / Request inventory verification
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC8241LVR166D
Manufacturer:
Freescale Semiconductor
Quantity:
135
Company:
Part Number:
MPC8241LVR166D
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC8241LVR166D
Manufacturer:
FREESCALE
Quantity:
20 000
5
This section details package parameters, pin assignments, and dimensions.
5.1
The MPC8241 uses a 25 mm × 25 mm, cavity up, 357-pin plastic ball grid array (PBGA) package. The
package parameters are as follows.
Freescale Semiconductor
Package Description
Package outline
Interconnects
Pitch
Solder balls
Solder ball diameter
Maximum module height
Co-planarity specification
Maximum force
Package Parameters for the MPC8241
TDI, TMS
TDO
TDO
TCK
MPC8241 Integrated Processor Hardware Specifications, Rev. 10
Figure 23. Test Access Port Timing Diagram
1.27 mm
ZP (PBGA)—62 Sn/36 Pb/2 Ag—available only in Rev B parts
ZQ (Thick substrate thick mold cap PBGA)—62 Sn/36 Pb/2 Ag
VR (Lead free version of package)—95.5 Sn/4.0 Ag/0.5 Cu
2.52 mm
0.15 mm
6.0 lbs. total, uniformly distributed over package (8 grams/ball)
25 mm × 25 mm
357
0.75 mm
12
13
Input Data Valid
10
Output Data Valid
11
Package Description
31