MPC8245LZU350D Freescale Semiconductor, MPC8245LZU350D Datasheet - Page 31

IC MPU 32BIT 350MHZ PPC 352-TBGA

MPC8245LZU350D

Manufacturer Part Number
MPC8245LZU350D
Description
IC MPU 32BIT 350MHZ PPC 352-TBGA
Manufacturer
Freescale Semiconductor
Series
PowerPCr
Datasheet

Specifications of MPC8245LZU350D

Processor Type
MPC82xx PowerQUICC II 32-bit
Speed
350MHz
Voltage
2V
Mounting Type
Surface Mount
Package / Case
352-TBGA
Core Size
32 Bit
Program Memory Size
32KB
Cpu Speed
350MHz
Digital Ic Case Style
BGA
No. Of Pins
352
Supply Voltage Range
1.9V To 2.2V
Operating Temperature Range
0°C To +105°C
Rohs Compliant
No
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-

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5
This section details package parameters, pin assignments, and dimensions.
5.1
The MPC8245 uses a 35 mm × 35 mm, cavity-up, 352-pin tape ball grid array (TBGA) package. The
package parameters are as follows.
Freescale Semiconductor
Package Description
Package Outline
Interconnects
Pitch
Solder Balls
Solder Ball Diameter
Maximum Module Height
Co-Planarity Specification
Maximum Force
Package Parameters
TDI, TMS
TDO
TDO
TCK
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Figure 23. Test Access Port Timing Diagram
35 mm × 35 mm
1.27 mm
VV (Lead-free version of package)
1.65 mm
0.15 mm
6.0 lbs. total, uniformly distributed over package (8 grams/ball)
352
ZU (TBGA package)
0.75 mm
12
13
62 Sn/36 Pb/2 Ag
Input Data Valid
10
Output Data Valid
11
95.5 Sn/4.0 Ag/0.5 Cu
Package Description
31

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