MPC8245TVV300D Freescale Semiconductor, MPC8245TVV300D Datasheet - Page 51

• Manufacturer Part Number: MPC8245TVV300D
• Description: IC MPU 32BIT 300MHZ PPC 352-TBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8245TVV300D

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 300MHz
• Voltage: 1.8V
• Mounting Type: Surface Mount
• Package / Case: 352-TBGA
• Processor Series: MPC8xxx
• Core: 603e
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 300 MHz
• Operating Supply Voltage: 1.8 V, 1.9 V, 2 V, 3.3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

The board designer can choose between several types of heat sinks to place on the MPC8245. Several
commercially-available heat sinks for the MPC8245 are provided by the following vendors:
Freescale Semiconductor
Aavid Thermalloy
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC) 818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Tyco Electronics
Chip Coolers™
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
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MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Figure 28. Die Junction-to-Ambient Resistance
0.5
Airflow Velocity (m/s)
1
No heat sink and high thermal board-level loading of
adjacent components
No heat sink and low thermal board-level loading of
adjacent components
Attached heat sink and high thermal board-level loading of
adjacent components
Attached heat sink and low thermal board-level loading of
adjacent components
1.5
603-224-9988
408-749-7601
800-522-6752
2
2.5
System Design
51