XPC8260CZUIFBC Freescale Semiconductor, XPC8260CZUIFBC Datasheet - Page 19

IC MPU POWERQUICC II 480-TBGA

XPC8260CZUIFBC

Manufacturer Part Number
XPC8260CZUIFBC
Description
IC MPU POWERQUICC II 480-TBGA
Manufacturer
Freescale Semiconductor
Series
PowerQUICC IIr
Datasheet

Specifications of XPC8260CZUIFBC

Processor Type
MPC82xx PowerQUICC II 32-bit
Speed
200MHz
Voltage
2.5V
Mounting Type
Surface Mount
Package / Case
480-TBGA
Core Size
32 Bit
Program Memory Size
32KB
Cpu Speed
133MHz
Embedded Interface Type
I2C, MII, SPI, TDM, UTOPIA
Digital Ic Case Style
TBGA
No. Of Pins
480
Rohs Compliant
No
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
XPC8260CZUIFBC
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Figure 11
Freescale Semiconductor
MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2
shows signal behavior in MEMC mode.
Generally, all MPC8260 bus and system output signals are driven from the
rising edge of the input clock (CLKin). Memory controller signals,
however, trigger on four points within a CLKin cycle. Each cycle is divided
by four internal ticks: T1, T2, T3, and T4. T1 always occurs at the rising
edge, and T3 at the falling edge, of CLKin. However, the spacing of T2 and
T4 depends on the PLL clock ratio selected, as shown in
Figure 12
Memory controller signals
1:2, 1:3, 1:4, 1:5, 1:6
CLKin
CLKin
CLKin
PLL Clock Ratio
Figure 12. Internal Tick Spacing for Memory Controller Signals
1:2.5
1:3.5
T1
T1
T1
is a graphical representation of
Table 11. Tick Spacing for Memory Controller Signals
CLKin
V_CLK
T2
T2
T2
1/4 CLKin
3/10 CLKin
4/14 CLKin
Figure 11. MEMC Mode Diagram
Tick Spacing (T1 Occurs at the Rising Edge of CLKin)
T3
T3
T3
T2
NOTE
T4
T4
1/2 CLKin
1/2 CLKin
1/2 CLKin
T4
Table
sp34/sp30
T3
11.
for 1:2, 1:3, 1:4, 1:5, 1:6
for 1:2.5
for 1:3.5
Table
3/4 CLKin
8/10 CLKin
11/14 CLKin
Electrical and Thermal Characteristics
11.
T4
19

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