KMC7457RX1000NC Freescale Semiconductor, KMC7457RX1000NC Datasheet - Page 43
KMC7457RX1000NC
Manufacturer Part Number
KMC7457RX1000NC
Description
IC MPU RISC 32BIT 1000MHZ 483BGA
Manufacturer
Freescale Semiconductor
Specifications of KMC7457RX1000NC
Processor Type
MPC74xx PowerPC 32-Bit
Speed
1.0GHz
Voltage
1.1V
Mounting Type
Surface Mount
Package / Case
483-FCCBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
KMC7457RX1000NC
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
8
The following sections provide the package parameters and mechanical dimensions for the CBGA
package.
8.1
The package parameters are as provided in the following list. The package type is 25
ceramic ball grid array (CBGA).
Freescale Semiconductor
Package Description
Package outline
Interconnects
Pitch
Minimum module height 2.72 mm
Maximum module height3.24 mm
Ball diameter
Package Parameters for the MPC7447, 360 CBGA
MPC7457 RISC Microprocessor Hardware Specifications, Rev. 7
25
360 (19
1.27 mm (50 mil)
0.89 mm (35 mil)
×
25 mm
×
19 ball array – 1)
×
25 mm, 360-lead
Package Description
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