XPC850DEZT50BT Freescale Semiconductor, XPC850DEZT50BT Datasheet - Page 8

no-image

XPC850DEZT50BT

Manufacturer Part Number
XPC850DEZT50BT
Description
IC POWER PC MPU 80MHZ 256-PBGA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of XPC850DEZT50BT

Processor Type
MPC8xx PowerQUICC 32-Bit
Speed
50MHz
Voltage
3.3V
Mounting Type
Surface Mount
Package / Case
256-PBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Other names
Q1146100
XPC8500DEZT50BT
XPC8500DEZT50BT

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
XPC850DEZT50BT
Manufacturer:
ON
Quantity:
3 000
Part Number:
XPC850DEZT50BT
Manufacturer:
MOTOLOLA
Quantity:
465
Part Number:
XPC850DEZT50BT
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
XPC850DEZT50BT
Manufacturer:
MOTOROLA/摩托罗拉
Quantity:
20 000
Thermal Characteristics
4
Table 3
Table 4
Table 5
8
Operating voltage at 40 MHz or less
Operating voltage at 40 MHz or higher
Input high voltage (address bus, data bus, EXTAL, EXTCLK,
and all bus control/status signals)
Input high voltage (all general purpose I/O and peripheral pins)
1
2
3
4
temperature rise of 13°C above ambient.
T
P
Thermal resistance for BGA
Thermal Resistance for BGA (junction-to-case)
Thermal Characteristics
J
shows the thermal characteristics for the MPC850.
Assumes natural convection and a single layer board (no thermal vias).
Assumes natural convection, a multilayer board with thermal vias
I/O
provides power dissipation information.
provides the DC electrical characteristics for the MPC850.
general, refer to AN-1231/D, Plastic Ball Grid Array Application Note available from your local Freescale sales
office.
temperature rise of 20°C above ambient.
= T
P
where:
For more information on the design of thermal vias on multilayer boards and BGA layout considerations in
Assumes natural convection, a multilayer board with thermal vias
MPC850 PowerQUICC™ Integrated Communications Processor Hardware Specifications, Rev. 2
D
is the power dissipation on pins
A
= (V
+ (P
DD
1
2
D
Power Dissipation
All Revisions
(1:1) Mode
Typical power dissipation is measured at 3.3V
Maximum power dissipation is measured at 3.65 V
I
θ
DD
JA
Characteristic
) + P
)
Characteristic
Characteristic
I/O
1
Table 5. DC Electrical Specifications
Table 3. Thermal Characteristics
Table 4. Power Dissipation (P
Frequency (MHz)
33
40
50
KAPWR, VDDSYN
KAPWR, VDDSYN
Typical
Symbol
VDDH, VDDL,
VDDH, VDDL,
TBD
TBD
TBD
θ
θ
θ
θ
JA
JA
JA
JC
Symbol
4
, 1 watt MPC850 dissipation, and a board
4
VIH
VIH
, 1 watt MPC850 dissipation, and a board
1
D
)
Maximum
515
590
725
Value
40
24
31
8
2
4
3
3.135
2
Min
3.0
2.0
2.0
Unit
mW
mW
mW
Freescale Semiconductor
3.465
Max
3.6
3.6
5.5
°C/W
°C/W
°C/W
°C/W
Unit
Unit
V
V
V
V

Related parts for XPC850DEZT50BT