MPC852TVR66 Freescale Semiconductor, MPC852TVR66 Datasheet - Page 8

• Manufacturer Part Number: MPC852TVR66
• Description: IC MPU POWERQUICC 66MHZ 256-PBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC852TVR66

• Processor Type: MPC8xx PowerQUICC 32-Bit
• Speed: 66MHz
• Voltage: 1.8V
• Mounting Type: Surface Mount
• Package / Case: 256-PBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

Thermal Calculation and Measurement
7 Thermal Calculation and Measurement
For the following discussions, P
7.1 Estimation with Junction-to-Ambient Thermal Resistance
An estimation of the chip junction temperature, T
T
where:
8
J
= T
A
T
R
P
+(R
A
D
θJA
1
2
3
4
Output high voltage, IOH = -2.0 mA,
V
Except XTAL and open drain pins
Output low voltage
IOL = 2.0 mA (CLKOUT)
IOL = 3.2 mA
IOL = 5.3 mA
IOL = 7.0 mA (Txd1/pa14, txd2/pa12)
IOL = 8.9 mA (TS, TA, TEA, BI, BB,
HRESET, SRESET)
= ambient temperature ºC
= power dissipation in package
θJA
DDH
TCK, TRST, TMS, MII_TXEN, MII_MDIO are 5 V-tolerant pins.
IWP(0:1)/VFLS(0:1), RXD3/PA11, TXD3/PA10, RXD4/PA9, TXD4/PA8, TIN3/BRGO3/CLK5/PA3,
BRGCLK2/TOUT3/CLK6/PA2, TIN4/BRGO4/CLK7/PA1, TOUT4/CLK8/PA0, SPISEL/PB31,
SPICLK/PB30, SPIMOSI/PB29, BRGO4/SPIMISO/PB28, SMTXD1/PB25, SMRXD1/PB24,
BRGO3/PB15, RTS1/DREQ0/PC15, RTS3/PC13, RTS4/PC12, CTS3/PC7, CD3/PC6,
CTS4/SDACK1/PC5, CD4/PC4, MII-RXD3/PD15, MII-RXD2/PD14, MII-RXD1/PD13, MII-MDC/PD12,
MII-TXERR/RXD3/PD11, MII-RX0/TXD3/PD10, MII-TXD0/RXD4/PD9, MII-RXCLK/TXD4/PD8,
MII-TXD3/PD5, MII-RXDV/RTS4/PD6, MII-RXERR/RTS3/PD7, MII-TXD2/REJECT3/PD4,
MII-TXD1/REJECT4/PD3, MII_CRS, MII_MDIO, MII_TXEN, MII_COL
WE2/BS_B2/PCOE, WE3/ BS_B3/PCWE, BS_A(0:3), GPL_A0/GPL_B0, OE/GPL_A1/GPL_B1,
GPL_A(2:3)/GPL_B(2:3)/CS(2:3), UPWAITA/GPL_A4, GPL_A5, ALE_A, CE1_A, CE2_A, DSCK,
OP(0:1), OP2/MODCK1/STS, OP3/MODCK2/DSDO, BADDR(28:30)
BDIP/GPL_B(5), BR, BG, FRZ/IRQ6, CS(0:5), CS(6), CS(7), WE0/BS_B0/IORD, WE1/BS_B1/IOWR,
The PA[0:3], PA[8:11], PB15, PB[24:25]; PB[28:31], PC[4:7], PC[12:13], PC15, PD[3:15], TDI, TDO,
Input capacitance is periodically sampled.
A(0:31), TSIZ0/REG, TSIZ1, D(0:31), DP(0:3)/IRQ(3:6), RD/WR, BURST, RSV/IRQ2,
= package junction-to-ambient thermal resistance (ºC/W)
x P
The V
= 3.0 V
D
)
DDSYN
Characteristic
3
4
power dissipation is negligible.
Table 5. DC Electrical Specifications (continued)
D
= (V
MPC852T Hardware Specifications, Rev. 3.1
DDL
x IDDL) + P
J
, in °C can be obtained from the equation:
NOTE
I/O
, where P
Symbol
VOH
VOL
I/O
is the power dissipation of the I/O drivers.
Min
2.4
—
Freescale Semiconductor
Max
0.5
—
Unit
V
V