XPC850VR50BU Freescale Semiconductor, XPC850VR50BU Datasheet - Page 67

• Manufacturer Part Number: XPC850VR50BU
• Description: IC MPU POWERQUICC 50MHZ 256-PBGA
• Manufacturer: Freescale Semiconductor

Specifications of XPC850VR50BU

• Processor Type: MPC8xx PowerQUICC 32-Bit
• Speed: 50MHz
• Voltage: 3.3V
• Mounting Type: Surface Mount
• Package / Case: 256-PBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -

Figure 65
Freescale Semiconductor
C
A1
A
Figure 65. Package Dimensions for the Plastic Ball Grid Array (PBGA)—JEDEC Standard
SIDE VIEW
MPC850 PowerQUICC™ Integrated Communications Processor Hardware Specifications, Rev. 2
shows the JEDEC package dimensions of the PBGA.
256X
SEATING
PLANE
A2
A3
0.35 C
0.20 C
4X
(E1)
0.20
4X
15X
E
e /2
B
A
e
E2
BOTTOM VIEW
2
3
4
5
CASE 1130-01
6
7
TOP VIEW
ISSUE B
8 9 10 11 12 13 14 15 16
(D1)
D2
15X
D
256X
e
0.30
0.15
b
M
M
17
C A B
C
U
R
N
M
K
H
G
D
C
B
T
P
L
J
F
E
Mechanical Data and Ordering Information
NOTES:
1.
2.
3.
4.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
DIMENSIONS IN MILLIMETERS.
DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO PRIMARY
DATUM C.
PRIMARY DATUM C AND THE SEATING PLANE ARE
DIM
A1
A2
A3
D1
D2
E1
E2
A
b
D
E
e
19.00
19.00
MILLIMETERS
MIN
1.91
0.50
1.12
0.29
0.60
23.00 BSC
19.05 REF
23.00 BSC
19.05 REF
1.27 BSC
20.00
20.00
MAX
2.35
0.70
1.22
0.43
0.90
67