MPC8321ECZQADDC Freescale Semiconductor, MPC8321ECZQADDC Datasheet - Page 49

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MPC8321ECZQADDC

Manufacturer Part Number
MPC8321ECZQADDC
Description
IC MPU PWRQUICC II 516-PBGA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MPC8321ECZQADDC

Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
266MHz
Voltage
1V
Mounting Type
Surface Mount
Package / Case
516-PBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC8321ECZQADDC
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
21 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8323E is available in
a thermally enhanced Plastic Ball Grid Array (PBGA); see
MPC8323E PBGA,”
information on the PBGA.
21.1
The package parameters are as provided in the following list. The package type is 27 mm × 27 mm, 516
PBGA.
21.2
Figure 42
516-PBGA package.
Freescale Semiconductor
MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4
Package outline
Interconnects
Pitch
Module height (typical)
Solder Balls
Ball diameter (typical)
Package Parameters for the MPC8323E PBGA
Mechanical Dimensions of the MPC8323E PBGA
shows the mechanical dimensions and bottom surface nomenclature of the MPC8323E,
and
Section 21.2, “Mechanical Dimensions of the MPC8323E PBGA,”
516
1.00 mm
2.25 mm
62 Sn/36 Pb/2 Ag (ZQ package)
95.5 Sn/0.5 Cu/4Ag (VR package)
0.6 mm
27 mm × 27 mm
Section 21.1, “Package Parameters for the
Package and Pin Listings
for
49

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