MCP2150-I/P Microchip Technology, MCP2150-I/P Datasheet - Page 10
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MCP2150-I/P
Manufacturer Part Number
MCP2150-I/P
Description
IC IRDA STD CONTROLLER 18DIP
Manufacturer
Microchip Technology
Datasheets
1.MCP2155-ISO.pdf
(6 pages)
2.MCP2155-ISO.pdf
(6 pages)
3.MCP2155-ISO.pdf
(4 pages)
4.MCP2150-IP.pdf
(52 pages)
Specifications of MCP2150-I/P
Package / Case
18-DIP (0.300", 7.62mm)
Controller Type
IRDA Standard Protocol Stack Controller
Interface
UART
Voltage - Supply
3 V ~ 5.5 V
Current - Supply
7mA
Operating Temperature
-40°C ~ 125°C
Mounting Type
Through Hole
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
Through Hole
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
MCP215XDM - BOARD DEMO FOR MCP215X
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCP2150-I/P
Manufacturer:
Microchip Technology
Quantity:
135
Company:
Part Number:
MCP2150-I/P
Manufacturer:
Microchip
Quantity:
129
Part Number:
MCP2150-I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
MCP2150
2.8
The device can be placed in a low power mode by dis-
abling the device (holding the EN pin at the low state).
The internal state machine is monitoring this pin for a
low level and, once this is detected, the device is
disabled and enters into a low power state.
2.8.1
When disabled, the device is in a low power state.
When the EN pin is brought to a high level, the device
will return to the operating mode. The device requires
a delay of 1024 T
or received.
FIGURE 2-5:
DS21655B-page 10
Minimizing Power
LLC (Logical Link Control)
Acceptance Filtering
Overload Notification
Recovery Management
MAC (Medium Access Control)
Data Encapsulation/Decapsulation
Frame Coding (stuffing, destuffing)
Medium Access Management
Error Detection
Error Signalling
Acknowledgment
Serialization/Deserialization
PLS (Physical Signalling)
Bit Encoding/Decoding
Bit Timing
Synchronization
PMA (Physical Medium Attachment)
Driver/Receiver Characteristics
MDI (Medium Dependent Interface)
Connectors
RETURNING TO DEVICE
OPERATION
OSI REFERENCE LAYERS
OSC
Data Link Layer
Physical Layer
before data may be transmitted
ISO REFERENCE LAYER MODEL
Presentation
Application
Transport
Network
Session
Preliminary
2.9
Figure 2-5
Model. The shaded areas are implemented by the
MCP2150, the cross-hatched area is implemented by
an infrared transceiver. The unshaded areas should be
implemented by the Host Controller.
Network Layering Reference
Model
shows the ISO Network Layering Reference
Has to be implemented in Host
Controller firmware
(such as a PICmicro
microcontroller)
Regions implemented
by the MCP2150
Regions implemented
by the Optical Transceiver logic
Fault
confinement
(MAC-LME)
Bus Failure
management
(PLS-LME)
Supervisor
2002 Microchip Technology Inc.
®